| 학회 | 한국재료학회 |
| 학술대회 | 2011년 봄 (05/26 ~ 05/27, 제주 휘닉스 아일랜드) |
| 권호 | 17권 1호 |
| 발표분야 | F. Display and optic Materials and processing(디스플레이 및 광 재료) |
| 제목 | Copper electrodeposition to improve the characteristic of electromagnetic shielding panels |
| 초록 | There are increased industrial demand for high-resolution panels by larger and high quality display products. Consequently, to secure optical and electrical property need to more precise mesh inserted electromagnetic shielding filer and the formation of uniform coating in the large-scale. In the copper electrodeposition process for the manufacture of large-area uniform coating, is depending on organic additives, Pulsation, auxiliary anode, shielding planning and so on. In this study, We have observed effect of an organic addition agent thiourea(TU) on the electroformed copper deposit through the various electrochemical method and using simulation to secure uniformity of large-area thin film coating. |
| 저자 | 임성봉, 이주열 |
| 소속 | 재료(연) |
| 키워드 | Cu electroplating; Thiourea; Pulsation; simulation; |
