| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 가을 (10/13 ~ 10/14, 제주 ICC) |
| 권호 | 30권 2호 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Cure Properties of New Epoxy Resin Systems for Halogen-free Epoxy Molding Compound(EMC) for Semiconductor Encapsulation II |
| 초록 | Cure kinetics of new epoxy resin systems for halogen-free epoxy molding compound (EMC) for semiconductor encapsulation were investigated. The phosphorous type flame retardant agent has been applied to semiconductor encapsulation for the requirements of halogen-free EMC, however, serious reliability problems resulted in some applications. Recently, the self-extinguishable resin systems without flame retardant agents were introduced for reliability improvements of phosphorous type EMC, In this study, new type epoxy resin systems with biphenyl moiety were introduced, which show UL-94/V-0 standard properties using optimum filler contents. Latent catalyst effects were also investigated in order to improve the physical properties and shelf life of halogen-free EMC. The cure kinetics of these systems were investigated by differential scanning calorimetry using isothermal approach, and the kinetic parameters of all systems were reported in terms of generalized kinetic equation with the diffusion effects. In previous study, the biphenyl epoxy resin system with TPP-BQ as latent catalyst shows the higher cure reaction conversion and mechanical properties than that with TPP as catalyst.1-2 However, These phenomena cannot be observed in the biphenyl type epoxy resin system including novolac moiety, which are caused by lower cure reaction conversion based on the interruption of molecular interactions between biphenyl groups.3 Fig. 1. Reaction Conversion of New Epoxy Resin Systems with TPP and TPP/BQ as catalyst Fig. 2. Curing Model of the bipheyl type epoxy resin systems with different functional phenolic hardeners references : 1) W.G. Kim and J.Y. Lee, Polymer, 43, 5713(2002). 2) J.H. Ryu, K.S. Choi and W.G. Kim, J. Appl. Polym. Sci., 96, 2287(2005). 3) M. Ochi, et al., J. Appl. Polym. Sci., 56, 1161(1995). |
| 저자 | 김환건1, 유제홍2, 간혜승1 |
| 소속 | 1서경대, 2제일모직 전자재료사업부 |
| 키워드 | Cure Kinetics; Halogen-free; Epoxy; Semiconductor |
