화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2010년 가을 (10/27 ~ 10/29, 대전컨벤션센터)
권호 14권 2호
발표분야 접착제.도료.잉크
제목 Improvement of anti-shock performance of acrylic PSAs for thin silicon wafer by foaming with chemical blowing agent
초록 The acrylic copolymers, which were used as base polymers for pressure sensitive adhesives, were synthesized by solution polymerization of 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid with 2,2’-azobisisobutyronitrile as an initiator. The acrylic copolymer adhesive foams were prepared with various different contents of chemical blowing agent (0.5, 1.0, and 2.0 phr). The chemical blowing by thermal treatment in the acrylic copolymer matrices was crucial in controlling the anti-shock properties of thin silicon wafer. The effect of foaming on the curing behavior and the adhesion properties of acrylic copolymer adhesives were also studied.
저자 유종민, 김형일
소속 충남대
키워드 adhesive; acrylic copolymer; chemical blowing; anti-shock; thin wafer
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