| 초록 |
Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. For making dense wiring of metal conductors, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for next generation PCB. It is an object of this research to develop an epoxy resin composition for an interlayer insulating material exhibiting both high thermal resistance and capability, an epoxy resin composition which is capable of giving a finer pattern and making an insulating layer thinner. And we investigated rheological behavior of dielectric materials on various blending process. |
