| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 봄 (04/09 ~ 04/10, 고려대학교) |
| 권호 | 29권 1호, p.156 |
| 발표분야 | 기능성 고분자 |
| 제목 | Surface modification of polyimide film by plasma and silane coupling reactions for copper metallization |
| 초록 | Polyimide (PI) is one of the most promising thermally stable polymers with mechanical properties high-performance materials endowed with excellent physical and mechanical properties. In the application for microelectronic devices, PI is frequently used as a composite with copper metal, for example in printed circuit boards. In the composite with copper metal which is deposited on the PI film surfaces by vacuum evaporator or sputtering techniques, PI film surfaces must be modified due to its poor adhesion with copper metal. In this study, we investigated the surface modification by a combination of plasma treatment and silane coupling reaction to improve the adhesion between copper metal and PI film. The analysis of modified PI surfaces and the adhesion with copper will be discussed. |
| 저자 | 강형대1, 김석제1, 이호성2, 서동학3, 최길영1, 홍영택1 |
| 소속 | 1한국화학(연), 2아텍 엔지니어링(주), 3한양대 |
| 키워드 | polyimide film; plasma; metallization; surface modification |
