| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 봄 (04/10 ~ 04/11, 컨벤션 뷰로(대전)) |
| 권호 |
33권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
The Study of Mechanical Property Change of LED refraction layer by Fillers and Silicone resin |
| 초록 |
The chip type LEDs need refraction layer to improve the light efficiency. However, some problems are happened between Au wire and refraction layers which are combination with Silicone resin and fillers. The one of the most serious problems is that the wire bonding is broken down. We try to solve this problem to reduce the mismatching of CTE and modulus between wire bonding and the material of refraction layer and to increase thermal conductivity. In this research, we change the kind of silicone resin and the ratio of fillers for refraction such as TiO2 and Tism and add other kinds of fillers. Moreover, we make an addition the higher thermal conductivity filler to increase the thermal conductivity of composite material. |
| 저자 |
윤상준1, 윤금희2, 이화영2, 김진철2, 박호준2, 오준록2
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| 소속 |
1삼성전기, 2삼성전기 중앙(연) |
| 키워드 |
LED; Filler; light efficiency; silicone resin; refraction layer
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| E-Mail |
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