| 학회 | 한국재료학회 |
| 학술대회 | 2004년 봄 (05/14 ~ 05/14, 강릉대학교) |
| 권호 | 10권 1호 |
| 발표분야 | 금속 |
| 제목 | 평형시간과 전류밀도가 Cu 전해 증착에 미치는 영향 |
| 초록 | The commercial electrolytic production of copper thin film and foil involves electrodepositing a dense and uniform layer of copper onto a cathode blank. In electordeposition of copper, the electro refining or winning operations should make a high-purity product having the quality requirements, such as integrity smoothness as well as mechanical and electrical properties. In order to achieve high production efficiency and the required product quality, the current efficiency and electric condition in the time dependent process are essential for most high-end electronic applications at the micro scale. The aim of this study is to examine the feasibility of using current/potential measurements as a means of gaining additional fundamental information on the initial nucleation and growth mechanisms for copper cluster on titanium substrates. For this purpose, attempts have been made to correlate the changes noted in potential-time curves caused by the presence of the additives commonly in copper electrodeposition with variations in the growth structure of metal. The electrolyte was prepared from Fisher certified grade cupric sulfate pentahydrate and reagent grade sulfuric acid to give a stock electrolyte with a concentration of 100g/l copper and 100g/l sulfuric acid. The electrolytic cell was a jacked glass beaker, which allowed for the electrolyte temperature to be maintained at 65℃ throughout run. The reference electrode was a mercury/mercurous sulfate electrode (+656mV vs SHE) which was placed in a Luggin capillary filled with 180g/l sulfuric acid. The copper counter electrode was placed in the electrolyte and separate from the working electrode by a fixed distance of 2cm. All the electrodepositon of copper on titanium substrate was controlled by a computerized system of EG&G Princeton Applied Research Model 273. |
| 저자 | 최병학1, 신수근1, 김미자1, 이용동1, 장현구2, 이종길3 |
| 소속 | 1강릉대, 2성균관대, 3Dept. of Materials Science and Eng |
| 키워드 | Cu electrodeposition; electrodepositing; Cu 전해증착 |
