| 학회 |
한국고분자학회 |
| 학술대회 |
2013년 가을 (10/11 ~ 10/12, 창원컨벤션센터) |
| 권호 |
38권 2호 |
| 발표분야 |
기능성 고분자 (포스터발표만 진행) |
| 제목 |
Dual Curing and Thermal Stability of Silicone Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-Chip Package Process |
| 초록 |
Multi-Chip Packages (MCP) refers to a packaging configuration, connected via wirebonds to a multilayer circuit board, and protected by either a molded encapsulant or a low-cost ceramic package. As it requires high processing temperature, the adhesives for MCP need to show proper adhesion and thermal stability at high temperature. This study employed dual-curable silicone urethane acrylic adhesives. UV-curing and thermal stability focused on different photoinitiator contents were investigated. |
| 저자 |
이승우1, 박초희1, 박지원1, 임동혁2, 김현중1, 송준엽3, 이재학3, 김형준3
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| 소속 |
1서울대, 2테크피아, 3기계(연) |
| 키워드 |
Dual Curing; Thermal Stability; Silicone Urethane Acrylic Adhesives; Temporary Bonding
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| E-Mail |
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