초록 |
Mesoporous organosilica (MOS) was fabricated in a shallow nanotrench of 25 nm width and 400 nm depth by vapor phase synthesis. Octyltrimethylammonium bromide (OTAB), dodecyltrimethylammonium bromide (DTAB), and cetyltrimethylammonium bromide (CTAB) were selected for the surfactants. Hydrochloric acid (HCl) was used as the catalyst for the condensation reaction that formed the organosilica in shallow trenches. The high elastic modulus of filled organosilica could be obtained due to crosslinking and closed mesoporous structure. It also has high porosity and a well ordered mesoporous form, resulting in a low dielectric constant. |