| 학회 |
한국고분자학회 |
| 학술대회 |
2007년 가을 (10/11 ~ 10/12, 일산킨텍스) |
| 권호 |
32권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
The preparation of low CTE dielectric materials for next generation PCB |
| 초록 |
Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. For making dense wiring of metal conductors, we investigated CTE and peel strength of dielectric materials for next generation PCB. It is an object of this research to develop an epoxy resin composition for an interlayer insulating material exhibiting low CTE and high peel strengnth and making an insulating layer thinner. |
| 저자 |
조재춘, 이근용, 오준록
|
| 소속 |
(주)삼성전기 중앙(연) |
| 키워드 |
Next generation PCB; CTE; peel strength
|
| E-Mail |
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