| 학회 |
한국재료학회 |
| 학술대회 |
2008년 봄 (05/22 ~ 05/23, 상록리조트) |
| 권호 |
14권 1호 |
| 발표분야 |
전자재료 |
| 제목 |
Effect of organic additives on the Interaction between Particle and Substrate in CMP Slurry |
| 초록 |
The direct force measurement between colloidal surfaces has been an essential topic in both theories and applications of surface chemistry. In this study, the change of interaction force between cerium oxide and substrate, such as silicon oxide and silicon nitride, was investigated in the chemical mechanical planarization (CMP) process by atomic force microscopy (AFM). This interaction force strongly depends on the addition of organic additives in the CMP slurry. The relationship between the organic additives and the interaction force is very important to predict to CMP performance. Interaction force was directly measured by the analysis of force-distance curve as a function of polymer addition using the CeO2 coated AFM tip. The effects of the concentration and molecular weight of organic additives on the CMP performance will be discussed. |
| 저자 |
최영민1, 배영화1, 류병환1, 강호철1, 신동목2, 노준석2, 조승범2
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| 소속 |
1KRICT, 2LG화학 |
| 키워드 |
AFM; Force-distance curve; CMP slurry
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| E-Mail |
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