| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.414 |
| 발표분야 | 기능성 고분자 |
| 제목 | Adhesion properties of copper on surface modified polyimide film |
| 초록 | The polyimide (PI) films is known to be a high-performance material that has been widely used in microelectronic industry. The adhesion of the copper to the polyimide film is generally poor. A number of surface modifications, such as wet-chemical treatment, plasma treatment, UV excimer irradiation, and ion beam irradiation have been applied to the polyimide substrates to enhance their adhesion to copper[1,2]. In this work, characteristics of copper on the polyimide film with surface modification are investigated. Wet process with KOH and ethylene diamine aqueous solutions was performed for the surface treatment of polyimide film. The surface modified polyimide film was analysed by fourier transform infrared (FT-IR) Spectroscopy. The copper coating used surface modified polyimide film by sputtering and electroplating. The peel strength of heat resistant and chemical resistant test was decreased. But, chemical resistant test is stabilized than the heat resistant test. Figure 1. Peel strength of copper on surface modified PI film; (a) heat resistant test, (b) chemical resistant test. Reference 1. Weixing Yu and Tze-Man Ko, European polymer journal 37, 1791 (2001). 2. Wei Chen, Junying Zhang, Qi Fang, Keliang Hu, and Ian W. Boyd, Thin solid films 453, 3 (2004). |
| 저자 | 김화진, 강휘원, 강형대, 김석제, 이재흥, 홍영택 |
| 소속 | 한국화학(연) |
| 키워드 | polyimide; FCCL; surface modification |
