| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.405 |
| 발표분야 | 기능성 고분자 |
| 제목 | Characterization and adhesion properties of modified polyimide film with ion beam and coupling agent containing ethylenimine group |
| 초록 | Polyimides(PI) are widely used in the microelectronics packaging industry especially in flexible printed circuit board (FPCB) because of its superior mechanical properties, high temperature resistance, solvent resistance and low dielectric constant. PI is frequently used as a composite with copper metal, for example in printed circuit boards. In the composite with copper metal which is deposited on the PI film surfaces by sputtering techniques, PI film surfaces must be modified due to its poor adhesion with copper metal. Its surface should be modified by ion-beam treatment to improve adhesion properties due to poor adhesion with copper. In this work, we investigated the surface modification by a combination of ion beam and novel coupling agent treatment to improve the adhesion between PI film and copper. Fig.1. showed morphology of modified PI film (Kapton E) surface by ion beam and novel coupling agent treatment. The detailed characterization and adhesion to copper of the modified PI film will be discussed. Fig 1. SEM and AFM image of modified polyimide film surface by ion-beam and novel coupling agent References 1. N. INAGAKI, S. TASAKA, A. ONODERA Journal of Applied Polymer Science, Vol. 73, 1645-1654(1999) 2. X.P.Zou, E.T.Kang, K.G.Neoh, Y.Zhang, K.L.Tan, C.Q.Cui and T.B.Lim, Polym.Adv.Technol.12,538-595 (2001) 3. Z.J.Yu, E.T.Kang ,K.G.Neoh, polymer 43, (2002) 4137-4146 |
| 저자 | 강형대1, 강휘원1, 김석제1, 서동학2, 홍영택1 |
| 소속 | 1한국화학(연), 2한양대 |
| 키워드 | polyimide; coupling agent; fccl; ion beam; sputtering |
