| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 봄 (04/10 ~ 04/11, 컨벤션 뷰로(대전)) |
| 권호 |
33권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Synthesis and Mechanical Properties of Epoxy Blend Composites for PCB application |
| 초록 |
Polymeric materials are mainly used in producing printed circuit board (PCB). The conventional manufacturing process of PCB requiring high temperature and pressure results in heavy loss of energy and increasing cost. To avoid these problems, adhesive strength between dielectric layer and circuit pattern is one of the most important properties to successfully fabricate reliable PCBs. Epoxy blend composites have been prepared by solution blending with various inorganic fillers. The influence of the adhesive strength between dielectric and copper layer has been investigated. Measured mechanical properties for the epoxy blend composites are related to the type of filler and content as determined by optic and scanning electron microscopy (SEM). |
| 저자 |
이근용, 임성택, 조재춘, 이화영, 오준록
|
| 소속 |
(주)삼성전기 중앙(연) |
| 키워드 |
epoxy blend; composite; PCB
|
| E-Mail |
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