| 초록 |
We report a new dual-coating method for the deposition of SiCOH ATMS low-k films on mesoporous SiO2 (SBA-15)/PEG (polyethylene glycol) composite films to improve the dielectric constant and mechanical properties of SiCOH/SBA-15 dual forms. The deposition is achieved via a two-step process: (i) pre-treatment, mixing SBA-15 with a dispersion of PEGs containing DI-water and formation of SBA-15/PEG composite films by spin-coating, and (ii) post-treatment, deposition of SiCOH films on SBA-15s functionalized with PEGs and post-thermal annealing. SiCOH/SBA-15 dual forms exhibited a 20% reduced dielectric constant without significant loss of mechanical properties in comparison with SiCOH only films after post-thermal annealing. Optical spectroscopy (SEM, TEM), XRD, BET, FT-IR, and XPS results show that such enhanced electrical properties can be attributed to mesoporous SiO2 and additional porosity through removal of PEG and CxHy (thermally labile phase in SiCOH films) after post-thermal annealing. |
