화학공학소재연구정보센터
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No. Article
1 Hard breakdown mechanisms of compensated p-type and n-type single-crystalline silicon solar cells
Dubois S, Veirman J, Enjalbert N, Scheiblin P
Solid-State Electronics, 76, 36, 2012
2 In-depth physical investigation of GeOI pMOSFET by TCAD calibrated simulation
Grandchamp B, Jaud MA, Scheiblin P, Romanjek K, Hutin L, Le Royer C, Vinet M
Solid-State Electronics, 57(1), 67, 2011
3 Dual strained channel CMOS in FDSOI architecture: New insights on the device performance
Le Royer C, Casse M, Cooper D, Andrieu F, Weber O, Brevard L, Perreau P, Damlencourt JF, Baudot S, Previtali B, Tabone C, Allain F, Scheiblin P, Rauer C, Figuet C, Aulnette C, Daval N, Nguyen BY, Bourdelle KK, Gyani J, Valenza M
Solid-State Electronics, 65-66, 9, 2011
4 Amorphization, recrystallization and end of range defects in germanium
Claverie A, Koffel S, Cherkashin N, Benassayag G, Scheiblin P
Thin Solid Films, 518(9), 2307, 2010
5 Honeycomb voids due to ion implantation in germanium
Kaiser RJ, Koffel S, Pichler P, Bauer AJ, Amon B, Claverie A, Benassayag G, Scheiblin P, Frey L, Ryssel H
Thin Solid Films, 518(9), 2323, 2010
6 High performance 70 nm gate length germanium-on-insulator pMOSFET with high-k/metal gate
Romanjek K, Hutin L, Le Royer C, Pouydebasque A, Jaud MA, Tabone C, Augendre E, Sanchez L, Hartmann JM, Grampeix H, Mazzocchi V, Soliveres S, Truche R, Clavelier L, Scheiblin P, Garros X, Reimbold G, Vinet M, Boulanger F, Deleonibus S
Solid-State Electronics, 53(7), 723, 2009
7 FDSOI devices with thin BOX and ground plane integration for 32 nm node and below
Fenouillet-Beranger C, Denorme S, Perreau P, Buj C, Faynot O, Andrieu F, Tosti L, Barnola S, Salvetat T, Garros X, Casse M, Allain F, Loubet N, Pham-Nguyen L, Deloffre E, Gros-Jean M, Beneyton R, Laviron C, Marin M, Leyris C, Haendler S, Leverd F, Gouraud P, Scheiblin P, Clement L, Pantel R, Deleonibus S, Skotnicki T
Solid-State Electronics, 53(7), 730, 2009