1425 - 1425 |
Solid-state electronics special issue foreword Ionescu AM, Leblebici Y |
1426 - 1431 |
Research directions in beyond CMOS computing Bourianoff GI, Gargini PA, Nikonov DE |
1432 - 1436 |
Superior N- and P-MOSFET scalability using carbon co-implantation and spike annealing Augendre E, Pawlak BJ, Kubicek S, Hoffmann T, Chiarella T, Kerner C, Severi S, Falepin A, Ramos J, De Keersgieter A, Eyben P, Vanhaeren D, Vandervorst W, Jurczak M, Absil P, Biesemans S |
1437 - 1443 |
A high performance pMOSFET with two-step recessed SiGe-S/D structure for 32 nm node and beyond Yasutake N, Azuma A, Ishida T, Ohuchi K, Aoki N, Kusunoki N, Mori S, Mizushima I, Morooka T, Kawanaka S, Toyoshima Y |
1444 - 1449 |
Carrier backscattering characteristics of strained silicon-on-insulator n-MOSFETs featuring silicon-carbon source/drain regions Ang KW, Chin HC, Chui KJ, Li MF, Samudra GS, Yeo YC |
1450 - 1457 |
High threshold voltage matching performance on gate-all-around MOSFET Cathignol A, Cros A, Harrison S, Cerrutti R, Coronel P, Pouydebasque A, Rochereau K, Skotnicki T, Ghibaudo G |
1458 - 1465 |
Experimental evidence and extraction of the electron mass variation in [110] uniaxially strained MOSFETs Rochette F, Casse M, Mouis M, Reimbold G, Blachier D, Leroux C, Guillaumot B, Boulanger F |
1466 - 1472 |
Reduction of gate-to-channel tunneling current in FinFET structures Rudenko T, Kilchytska V, Collaert N, Jurczak M, Nazarov A, Flandre D |
1473 - 1478 |
Quantifying self-heating effects with scaling in globally strained Si MOSFETs Agaiby R, Yang Y, Olsen SH, O'Neill AG, Eneman G, Verheyen P, Loo R, Claeys C |
1479 - 1484 |
CMOS compatible dual metal gate integration with successful V-th adjustment on high-k HfTaON by high-temperature metal intermixing Ren C, Chan DSH, Loh WY, Lo GQ, Balasubramanian N, Kwong DL |
1485 - 1493 |
Modeling of MOSFET parasitic capacitances, and their impact on circuit performance Mueller J, Thoma R, Demircan E, Bernicot C, Juge A |
1494 - 1499 |
Experimental evidence of mobility enhancement in short-channel ultra-thin body double-gate MOSFETs by magnetoresistance technique Chaisantikulwat W, Mouis M, Ghibaudo G, Cristoloveanu S, Widiez J, Vinet M, Deleonibus S |
1500 - 1507 |
Length scaling of the Double Gate Tunnel FET with a high-K gate dielectric Boucart K, Ionescu AM |
1508 - 1514 |
Germanium FETs and capacitors with rare earth CeO2/HfO2 gates Dimoulas A, Panayiotatos Y, Sotiropoulos A, Tsipas P, Brunco DP, Nicholas G, Van Steenbergen J, Bellenger F, Houssa M, Caymax M, Meuris M |
1515 - 1522 |
A systematic investigation of work function in advanced metal gate-HfO2-SiO2 structures with bevel oxide Kuriyama A, Mitard J, Faynot O, Brevard L, Clerc L, Tozzo A, Vidal V, Deleonibus S, Iwai H, Cristoloveanu S |
1523 - 1528 |
A novel channel-program-erase technique with substrate transient hot carrier injection for SONOSNAND flash application Hsu TH, King YC, Wu JY, Shih YH, Lue HT, Lai EK, Hsieh KY, Liu R, Lu CY |
1529 - 1533 |
New TIT capacitor with ZrO2/Al2O3/ZrO2 dielectrics for 60 nm and below DRAMs Cho HJ, Kim YD, Park DS, Lee E, Park CH, Jang JS, Lee KB, Kim HW, Ki YJ, Han K, Song YW |
1534 - 1539 |
DRAM retention tail improvement by trap passivation Weber A, Birner A, Krautschnelder W |
1540 - 1546 |
Investigation of hafnium-aluminate alloys in view of integration as interpoly dielectrics of future Flash memories Molas G, Bocquet M, Buckley J, Grampeix H, Gely M, Colonna JP, Licitra C, Rochat N, Veyront T, Garros X, Martin F, Brianceau P, Vidal V, Bongiorno C, Lombardo S, De Salvo B, Deleonibus S |
1547 - 1551 |
VDNROM: A novel four-physical-bits/cell vertical channel dual-nitride-trapping-layers ROM for high density flash memory applications Zhou F, Cai Y, Huang R, Li Y, Shan X, Liu J, Guo A, Zhang X, Wang Y |
1552 - 1557 |
Single-electron random-number generator (RNG) for highly secure ubiquitous computing applications Uchida K, Tanamoto T, Fujita S |
1558 - 1564 |
Monte-Carlo simulation of decananometric nMOSFETs: Multi-subband vs. 3D-electron gas with quantum corrections Riolino I, Braccioli M, Lucci L, Palestri P, Esseni D, Fiegna C, Selmi L |
1565 - 1571 |
Geometry optimization for carbon nanotube transistors Pourfath M, Kosina H, Selberherr S |
1572 - 1580 |
An industrial view on compact modeling Woltjer R, Tiemeijer L, Klaassen D |
1581 - 1588 |
An EKV-based high voltage MOSFET model with improved mobility and drift model Chauhan YS, Gillon R, Bakeroot B, Krummenacher F, Declercq M, Ionescu AM |
1589 - 1595 |
Power Trench MOSFETs with very low specific on-resistance for 25 V applications Goarin P, van Dalen R, Koops G, Le Cam C |
1596 - 1608 |
One and two port piezoelectric higher order contour-mode MEMS resonators for mechanical signal processing Piazza G, Stephanou PJ, Pisano AP |
1609 - 1617 |
Modeling and system-level simulation of a CMOS convective accelerometer Leman O, Chaehoi A, Mailly F, Latorre L, Nouet P |
1618 - 1623 |
Bandgap engineering in Alq(3)- and NPB-based organic light-emitting diodes for efficient green, blue and white emission Divayana Y, Sun XW, Chen BJ, Lo GQ, Sarma KR, Kwong DL |
1624 - 1628 |
High pass filter with above IC integrated SrTiO3 high K MIM capacitors Defay E, Wolozan D, Blanc JP, Serret E, Garrec P, Verrun S, Pellissier D, Delpech P, Guillan J, Andre B, Ulmer L, Aid M, Ancey P |