571 - 579 |
Electrical characteristics modeling of large area boron compensated 6H-SiC pn structures Brezeanu G, Badila M, Tudor B, Godignon P, Millan J, Locatelli ML, Chante JP, Lebedev A, Savkina NS |
581 - 585 |
A new wide voltage operation regime double heterojunction bipolar transistor Cheng SY, Pan HJ, Feng SC, Yu KH, Tsai JH, Liu WC |
587 - 592 |
Experimental I-V characteristics of AlGaAs/GaAs and GaInP/GaAs (D)HBTs with thin bases Hsin YM, Asbeck PM |
593 - 604 |
Design tradeoff guidelines for n-channel delta-doped Si/SiGe heterojunction MOSFETs Ip BK, Brews JR |
605 - 611 |
An equivalent electric-field approximation for formulating sheet density of induced electrons in a silicon layer of symmetric and asymmetric double-gate SOI MOSFETs Ikeno R, Aoki M |
613 - 617 |
Temperature dependence of GaN high breakdown voltage diode rectifiers Chyi JI, Lee CM, Chuo CC, Cao XA, Dang GT, Zhang AP, Ren F, Pearton SJ, Chu SNG, Wilson RG |
619 - 622 |
Surface and bulk leakage currents in high breakdown GaN rectifiers Ren F, Zhang AP, Dang GT, Cao XA, Cho H, Pearton SJ, Chyi JI, Lee CM, Chuo CC |
623 - 630 |
Anode hole injection and stress induced leakage current decay in metal-oxide-semiconductor capacitors Meinertzhagen A, Petit C, Jourdain M, Mondon F |
631 - 638 |
Characteristics of high breakdown voltage Schottky barrier diodes using p(+)-polycrystalline-silicon diffused-guard-ring Liou BW, Lee CL |
639 - 648 |
Room temperature annealing of 5.48 MeV He induced defect in p(+)n and n(+)p grown by metal-organic chemical vapour deposition Khan A |
649 - 654 |
High temperature characteristics of GaN-based Heterojunction Bipolar Transistors and Bipolar Junction Transistors Cao XA, Van Hove JM, Klaassen JJ, Polley CJ, Wowchack AM, Chow PP, King DJ, Ren F, Dang G, Zhang AP, Abernathy CR, Pearton SJ |
655 - 661 |
Non-alloyed Pd/Sn and Pd/Sn/Au Ohmic contacts for GaAs MESFETs: Technology and performance Islam MS, McNally PJ, Alam AHMZ, Huda MQ |
663 - 671 |
Barrier height inhomogeneities of epitaxial CoSi2 Schottky contacts on n-Si (100) and (111) Zhu SY, Van Meirhaeghe RL, Detavernier C, Cardon F, Ru GP, Qu XP, Li BZ |
673 - 675 |
New simple procedure to determine the threshold voltage of MOSFETs Sanchez FJG, Ortiz-Conde A, De Mercato G, Salcedo JA, Liou JJ, Yue Y |
677 - 684 |
Extraction of the lightly doped drain concentration of fully depleted SOINMOSFETs using the back gate bias effect Nicolett AS, Martino JA, Simoen E, Claeys C |
685 - 690 |
GaN epilayers grown on 100 mm diameter Si(111) substrates Liaw HM, Venugopal R, Wan J, Doyle R, Fejes PL, Melloch MR |
691 - 696 |
A new mobility model to explain the transconductance overshoot effect observed in ultra-short-channel length MOSFETs Kolhatkar JS, Dutta AK |
697 - 701 |
Coupling-induced magnetoresistance features in strongly coupled double quantum wells Velasquez R |
703 - 711 |
Microelectronic circuit characterization via photothermal radiometry of scribeline recombination lifetime Rodriguez ME, Mandelis A, Pan G, Garcia JA, Riopel Y |
713 - 718 |
Fast switching of light-emitting diodes Brailovsky AB, Mitin VV |
719 - 724 |
Short circuit current vs cell thickness in solar cells under rear illumination: a direct evaluation of the diffusion length Pla JC, Tamasi MJL, Bolzi CG, Venier GL, Duran JC |
725 - 728 |
Reactive ion etching of GaN using BCl3, BCl3/Ar and BCl3/N-2 gas plasmas Basak D, Nakanishi T, Sakai S |
729 - 737 |
Distributive effects on HBT S-parameters Anholt R |
739 - 746 |
Photo-luminescence and transmission electron microscope studies of low-and high-reliability AlGaAs/GaAs HBTs Mohammadi S, Hubbard SM, Chelli C, Pavlidis D, Bayraktaroglu B |
747 - 755 |
Crystallinity and microstructures of aluminum nitride films deposited on Si(111) substrates Liaw HM, Doyle R, Fejes PL, Zollner S, Konkar A, Linthicum KJ, Gehrke T, Davis RF |
757 - 760 |
W ohmic contact for highly doped n-type GaN films Lin CF, Cheng HC, Chi GC |