1251 - 1257 |
A Schottky diode clamped merged drain CMOS structure Huang FJ, O K |
1259 - 1263 |
Effects of surface oxide on SiGe/Si diode characteristics Hirose F |
1265 - 1272 |
Analytical model for extrinsic time-dependent dielectric breakdown of thin gate oxide Katto H |
1273 - 1281 |
Investigation of interface charges at the heterojunction discontinuity in HBT devices de la Fuente JG, Krozer V |
1283 - 1287 |
Analysis of reverse current-voltage characteristics of Schottky diodes based on phonon-assisted tunneling including Frenkel emission mechanism Pipinys P, Rimeika A, Pipiniene A |
1289 - 1294 |
A comparative study of GaAs- and InP-based superlattice emitter resonant tunneling bipolar transistors (SE-RTBT's) Chen CY, Wang WC, Chiou WH, Wang CK, Chuang HM, Cheng SY, Liu WC |
1295 - 1299 |
Theoretical analysis of noise transfer in wavelength converter based on cross-gain modulation in semiconductor optical amplifiers Wu SB, Sun XH, Yang C, Zhang MD |
1301 - 1305 |
Degradation of GaAs/AlGaAs heterojunction bipolar transistors with ion-implant isolation Frei MR, Chiu TY, Abernathy CR, Ren F, Fullowan TR, Lothian J, Pearton SJ, Tseng B, Montgomery RK, Smith PR |
1307 - 1313 |
Deformation of a deep-level transient spectroscopy spectrum by an inhomogeneous carrier concentration depth profile Ito A, Tokuda Y |
1315 - 1324 |
Enhanced modelization of ion implant simulation in compound semiconductors Hernandez-Mangas JM, Enriquez L, Arias J, Jaraiz M, Bailon L |
1325 - 1331 |
A simple approach to understanding measurement errors in the cross-bridge Kelvin resistor and a new pattern for measurements of specific contact resistivity Ono M, Nishiyama A, Toriumi A |
1333 - 1338 |
Design and optimization of thin film fully depleted vertical surrounding gate (VSG) MOSFETs for enhanced short channel immunity Kranti A, Rashmi, Haldar S, Gupta RS |
1339 - 1343 |
Analysis of the thin-film SOI lateral bipolar transistor and optimization of its output characteristics for high-temperature applications Adriaensen S, Flandre D |
1345 - 1349 |
Comparison of ohmic contact properties on n-GaN/p-SiC and n-AlGaN/p-SiC heterojunctions Luo B, Kim J, Mehandru R, Ren F, Lee KP, Pearton SJ, Polyakov AY, Smirnov NB, Govorkov AV, Kozhukhova EA, Osinsky AV, Norris PE |
1351 - 1358 |
A novel fabrication process for polysilicon thin film transistors with source/drain contacts formed by deposition and lift-off of highly doped layers Cuscuna M, Bonfiglietti A, Carluccio R, Mariucci L, Mecarini F, Pecora A, Stanizzi M, Valletta A, Fortunato G |
1359 - 1365 |
Influence of PECVD deuterated SiNx on GaAs MESFETs and GaAs/AlGaAs HBTs Luo B, Ren F, Wu CS, Pearton SJ, Abernathy CR, MacKenzie KD |
1367 - 1373 |
Development of plasma dielectric deposition method for increased pre-metal dielectric interfacial film stability Lobbins JM, Pearton SJ, Ren F |
1375 - 1380 |
Electrical characteristics of metal-oxide-semiconductor capacitors on plasma etch-damaged silicon carbide Koo SM, Lee SK, Zetterling CM, Ostling M |
1381 - 1387 |
Extraction of the oxide charge density at front and back interfaces of SOI nMOSFETs devices Nicolett AS, Martino JA, Simoen E, Claeys C |
1389 - 1394 |
The influence of InGaP barrier layer on the characteristics of 1.3 mu m strain-compensated multiquantum-well InAsP/InP/InGaP laser diodes Lee CY, Jiang WJ, Wu MC, Ho WJ |
1395 - 1398 |
An improved model for substrate current of submicron MOSFETs Gao X, Liou JJ, Bernier J, Croft G |
1399 - 1403 |
Electrical properties of SiN/GaN MIS diodes formed by ECR-CVD Chang KM, Cheng CC, Lang CC |
1405 - 1409 |
Low-temperature electrical characterizations of InAs1-x-ySbyPx photodiodes fabricated by liquid-phase epitaxy Uen WY, Liao SM, Lin CT, Wu CH |
1411 - 1416 |
Intrinsic and extrinsic photoresponse of Mo/n-Si/Mo structures with wide electrode gap Kobayashi K, Niemcharoen S, Supadech S, Yasumura Y, Sato K |
1417 - 1420 |
Structural and transport properties of CdS films deposited on flexible substrates Shur MS, Rumyantsev S, Gaska R, Wei BQ, Vajtai R, Ajayan PM, Sinius J |
1421 - 1425 |
Trade off between polysilicon film quality and thin film transistor operational amplifier DC gain Afentakis T, Hatalis M |
1427 - 1431 |
Ohmic contact characterization of AlGaN/GaN device layers with spatially localized LEEN spectroscopy Jessen GH, White BD, Bradley ST, Smith PE, Brillson LJ, Van Nostrand JE, Fitch R, Via GD, Gillespie JK, Dettmer RW, Sewell JS |
1433 - 1440 |
Reduction of the Schottky barrier height on silicon carbide using Au nano-particles Lee SK, Zetterling CM, Ostling M, Aberg I, Magnusson MH, Deppert K, Wernersson LE, Samuelson L, Litwin A |
1441 - 1444 |
A comparative study of surface passivation on AlGaN/GaN HEMTs Lu W, Kumar V, Schwindt R, Piner E, Adesida I |
1445 - 1451 |
Noise-gain tradeoff in RF SiGeHBTs Niu GF, Cressler JD, Zhang SM, Joseph A, Harame D |
1453 - 1457 |
Comparison of the effects of deuterated SiNx films on GaN and GaAs rectifiers Luo B, Baik K, Ren F, Pearton SJ, MacKenzie KD |
1459 - 1462 |
Electrical characteristics of p-GaN Schottky rectifiers after PECVD SiNx passivation Baik KH, Luo B, Kim J, Pearton SJ, Ren F |
1463 - 1466 |
Determination of deep trap concentration at channel-substrate interface in GaAs MESFET using sidegating measurements Khuchua NP, Khvedelidze LV, Gorev NB, Privalov EN, Shur MS |
1467 - 1469 |
Observation of inversion behavior in n-type GaN planar metal-insulator-semiconductor capacitor Irokawa Y, Nakano Y |