607 - 616 |
Rational Pattern Design for in-Vitro Cellular Networks Using Surface Photochemistry Hickman JJ, Bhatia SK, Quong JN, Shoen P, Stenger DA, Pike CJ, Cotman CW |
617 - 619 |
Chlorine-Enhanced F-Atom Etching of Silicon Coburn JW |
620 - 635 |
Simulation of Surface-Topography Evolution During Plasma-Etching by the Method of Characteristics Arnold JC, Sawin HH, Dalvie M, Hamaguchi S |
636 - 647 |
Dynamics of Ion-Assisted Etching in the Si(100)/Xef2/Ar+ System on a Time-Scale 100-Mu-S-1000-S Joosten GJ, Vugts MJ, Spruijt HJ, Senhorst HA, Beijerinck HC |
648 - 657 |
Etching of Si Surfaces with Hot Chlorine Beams - Translational and Vibrational-Excitation of the Incident Chlorine Particles Szabo A, Engel T |
658 - 664 |
Fluorocarbon High-Density Plasma .5. Influence of Aspect Ratio on the Etch Rate of Silicon Dioxide in an Electron-Cyclotron-Resonance Plasma Joubert O, Oehrlein GS, Zhang Y |
665 - 670 |
Fluorocarbon High-Density Plasma .6. Reactive Ion Etching Lag Model for Contact Hole Silicon Dioxide Etching in an Electron-Cyclotron-Resonance Plasma Joubert O, Oehrlein GS, Surendra M |
671 - 676 |
Combined Instrument for the Online Investigation of Plasma-Deposited or Etched Surfaces by Monochromatized X-Ray Photoelectron-Spectroscopy and Time-of-Flight Secondary-Ion Mass-Spectrometry Jahn PW, Petrat FM, Wolany D, Deimel M, Gantenfort T, Schmerling C, Wensing H, Wiedmann L, Benninghoven A |
677 - 680 |
Adverse-Effects on Plasma-Polymerized Films Due to Previous Oxygen Etching in an Electrodeless Reactor Wymore T, Nichols MF |
681 - 689 |
Synchrotron-Radiation (5-50 eV) Induced Degradation of Fluorinated Polymers Simons JK, Frigo SP, Taylor JW, Rosenberg RA |
690 - 698 |
Study of the NF3 Plasma Cleaning of Reactors for Amorphous-Silicon Deposition Bruno G, Capezzuto P, Cicala G, Manodoro P |
699 - 706 |
Chemical and Morphological-Changes on Silver Surfaces Produced by Microwave Generated Atomic Oxygen Bhan MK, Nag PK, Miller GP, Gregory JC |
707 - 713 |
Characterization of Silver Films Deposited by Radio-Frequency Magnetron Sputtering Marechal N, Quesnel E, Pauleau Y |
714 - 717 |
CdTe Oxide-Films Grown by Radio-Frequency Sputtering Utilizing Argon Nitrous-Oxide Plasma Zapatanavarro A, Zapatatorres M, Sosa V, Bartoloperez P, Pena JL |
718 - 722 |
Study of the Time-Dependence of Differentially Sputtered Currents from Multiphase Powder Targets Cohen Y, Riess I |
723 - 726 |
Planar Magnetron Glow-Discharge on Copper - Empirical and Semiempirical Relations Escrivao ML, Moutinho AM, Maneira MJ |
727 - 732 |
Thickness-Dependent Stress in Sputtered Carbon-Films Puchert MK, Timbrell PY, Lamb RN, Mckenzie DR |
733 - 736 |
Properties of Ticn Coatings Prepared by Magnetron Sputtering Deng JG, Braun M, Gudowska I |
737 - 745 |
Loss of Selectivity During W-Chemical Vapor-Deposition on Si Using the Wf6/SiH4 Process Groenen PA, Tekcan OF, Holscher JG, Brongersma HH |
746 - 750 |
Adhesion Between Polycarbonate Substrate and SiO2 Film Formed from Silane and Nitrous-Oxide by Plasma-Enhanced Chemical-Vapor-Deposition Shinoda M, Nishide T, Shichi Y |
751 - 753 |
Preparation of Amorphous BaTiO3 Thin-Films on Indium Tin Oxide-Coated Soda Lime Glass by Metalorganic Chemical-Vapor-Deposition Yoon YS, Lee DH, Kim TS, Oh MH, Yom SS |
754 - 759 |
Deposition of Amorphous Hydrogenated Silicon-Carbide Films Using Organosilanes in an Argon Hydrogen Plasma Maya L |
760 - 768 |
Comparison of Argon Electron-Cyclotron-Resonance Plasmas in 3 Magnetic-Field Configurations .2. Energy-Distribution of Argon Ions Junck KL, Getty WD |
769 - 771 |
Electric-Field in Surface-Wave-Produced Plasmas Komachi K |
772 - 782 |
Valence-Band Structure of Pmda-Oda Polyimide Studied by X-Ray Photoelectron-Spectroscopy and Theoretical Calculations Nakayama Y, Baltzer P, Wannberg B, Gelius U, Stafstrom S, Lunell S |
783 - 789 |
Characterization by Auger-Spectroscopy of Niobium Aluminum-Oxide Niobium Sandwiches for Josephson-Junctions Lacquaniti V, Bergoglio M, Steni R |
790 - 793 |
Depth Profile Optimization Naumkin AV, Vasilyev LA |
794 - 801 |
Dependence of Resolution on Sample Material in Rotational Auger Depth Profiling Tanemura M, Okuyama F |
802 - 806 |
Core-Valence Auger-Spectra of Lial Zintl Intermetallic Compound Jang GE, Curelaru IM, Kim HG |
807 - 812 |
Metallization of Teflon PFA .2. Interactions of Ti, Ag, and Au Measured by X-Ray Photoelectron-Spectroscopy Shi MK, Lamontagne B, Selmani A, Martinu L, Sacher E, Wertheimer MR, Yelon A |
813 - 819 |
Thin Gold Film Strain-Gauges Li CS, Hesketh PJ, Maclay GJ |
820 - 825 |
Atomic Release of Hydrogen from Pure and Boronized Graphites Franzen P, Vietzke E |
826 - 830 |
Reduction of Photodesorption Yield by Oxygen Discharge Cleaning Ota N, Saitoh M, Kanazawa K, Momose T, Ishimaru H |
831 - 834 |
2-Photon Laser-Induced Fluorescence Measurements of Absolute Atomic-Hydrogen Densities and Powder Formation in a Silane Discharge Czarnetzki U, Miyazaki K, Kajiwara T, Muraoka K, Okada T, Maeda M, Suzuki A, Matsuda A |
835 - 838 |
Precise Property Determinations of Arsenosilicate Glass Thin-Films Using Infrared-Spectroscopy Niemczyk TM, Wangmaneerat B, Haaland DM |
839 - 845 |
Infrared-Absorption Spectroscopy for Monitoring Condensable Gases in Chemical-Vapor-Deposition Applications Oneill JA, Passow ML, Cotler TJ |
846 - 853 |
Gas Desorption from an Oxygen-Free High-Conductivity Copper Vacuum Chamber by Synchrotron-Radiation Photons Grobner O, Mathewson AG, Marin PC |
854 - 860 |
Small Ultrahigh-Vacuum Compatible Hyperthermal Oxygen-Atom Generator Outlaw RA, Davidson MR |
861 - 866 |
Pumping of Helium and Hydrogen by Sputter-Ion Pumps .2. Hydrogen Pumping Welch KM, Pate DJ, Todd RJ |
867 - 872 |
Thermal Outgassing Behavior and Photoemission-Studies of Haynes Alloy-214 Sharma PK, Hickey GS |
873 - 875 |
Reaction-Mechanism Between BN-Sprayed Graphite and Molten Al in Vacuum, and Its Application to the Evaporation Source for Reactive Metals Including Al Jeong JI, Lim BM, Moon JH, Hong JH, Kang JS, Lee YP |
876 - 878 |
New Technique for Coprecipitation of Organic-Dye with Polymer Under High-Vacuum Hiraga T, Tanaka N, Takarada S, Hayamizu K, Kikuchi N, Moriya T |
879 - 882 |
Vacuum-Ultraviolet Emission from Microwave Plasmas of Hydrogen and Its Mixtures with Helium and Oxygen Hollander A, Wertheimer MR |
883 - 885 |
In-Situ Bend Fixture for Deformation and Fracture Studies in the Environmental Scanning Electron-Microscope Kalnas CE, Mansfield JF, Was GS, Jones JW |
886 - 888 |
Effect of Anode Bias on Plasma-Confinement in Direct-Current Magnetron Discharges Doyle JR, Nuruddin A, Abelson JR |
889 - 891 |
Instrument for the Measurement of Adhesion Forces in Ultrahigh-Vacuum Surface-Analysis Apparatuses Takahashi K, Iiyama T, Katoh N, Onzawa T |