102 - 102 |
Medard W. Welch award [Anonymous] |
1511 - 1516 |
Growth behaviors of low-pressure metalorganic chemical vapor deposition aluminum silicate films deposited with two kinds of silicon sources: Hexamethyidisilazane and tetraethyl orthosilicate Kuo DH, Chuang PY |
1517 - 1524 |
Growth-controlled cubic zirconia microstructure in zirconia-titania nanolaminates DeLoach JD, Aita CR, Loong CK |
1525 - 1531 |
Ion-enhanced chemical etching of ZrO2 in a chlorine discharge Sha L, Cho BO, Chang JP |
1532 - 1535 |
Annealing behavior of a Cs2O/Cs2O2/GaAs(110) surface studied by electron spectroscopy Wu JX, Li FQ, Zhu JS, Ji MR, Ma MS |
1536 - 1556 |
Semiempirical profile simulation of aluminum etching in Cl-2/BCl3 plasma Cooperberg DJ, Vahedi V, Gottscho RA |
1557 - 1565 |
Transition layers in metal bilayers produced by pulsed laser deposition in vacuum Tselev A, Gorbunov A, Pompe W |
1566 - 1573 |
Generating high-efficiency neutral beams by using negative ions in an inductively coupled plasma source Samukawa S, Sakamoto K, Ichiki K |
1574 - 1581 |
Redeposition of etch products on sidewalls during SiO2 etching in a fluorocarbon plasma. I. Effect of particle emission from the bottom surface in a CF4 plasma Min JH, Hwang SW, Lee GR, Moon SH |
1582 - 1586 |
Thermal decomposition pathway and desorption study of isopropanol and tert-butanol on Si(100) Kim J, Kim K, Yong K |
1587 - 1591 |
Optimized oxygen plasma etching of polyimide films for low loss optical waveguides Agarwal N, Ponoth S, Plawsky J, Persans PD |
1592 - 1596 |
Two-directional N-2 desorption in thermal dissociation of N2O on Rh(110), Ir(110), and Pd(110) at low temperatures Horino H, Rzeznicka I, Kokalj A, Kobal I, Ohno Y, Hiratsuka A, Matsushima T |
1597 - 1602 |
Giant polarization in organic heterostructures Thurzo I, Kampen TU, Zahn DRT |
1603 - 1610 |
Diode laser measurements of CFx species in a low-pressure, high-density plasma reactor Littau ME, Sowa MJ, Cecchi JL |
1611 - 1620 |
X-ray photoelectron spectroscopy study of two nitrogen-containing polymer surfaces metallized by nickel Bebin P, Prud'homme RE |
1621 - 1631 |
Performance characteristics of single-stage disk-type drag pump Heo JS, Hwang YK |
1632 - 1638 |
W and WC layers deposition by shielded inductively coupled plasma source Colpo P, Meziani T, Sauvageot P, Ceccone G, Gibson PN, Rossi F, Monge-Cadet P |
1639 - 1643 |
Structure and properties of carbon nitride thin films synthesized by nitrogen-ion-beam-assisted pulsed laser ablation Chen ZY, Zhao JP, Yano T, Shinozaki T, Ooie T |
1644 - 1646 |
Structural study on (CH3)(2)S/Cu(100) by near edge x-ray absorption fine structure and x-ray photoelectron spectroscopy Yagi S, Nakano Y, Ikenaga E, Sardar SA, Syed JA, Soda K, Hashimoto E, Tanaka K, Taniguchi M |
1647 - 1652 |
Helium permeation through a-C : H films deposited on polymeric substrates Valentini L, Bellachioma MC, Lozzi L, Santucci S, Kenny JM |
1653 - 1658 |
Abnormal room-temperature oxidation of silicon in the presence of copper Hinode K, Takeda K, Kondo S |
1659 - 1662 |
Effects of bridge pattern on performance of YBaCuO microbolometers Laou P, Phong LN |
1663 - 1666 |
Secondary ion mass spectrometry induced damage adjacent to analysis craters in silicon Clark MH, Jones KS, Stevie FA |
1667 - 1675 |
Recommended practices for measuring and reporting outgassing data Redhead PA |
1676 - 1681 |
Chemical structure of ultrathin SiO2 film with nitrogen incorporated by remote nitrogen plasma Cho MH, Roh YS, Whang CN, Jeong K, Ko DH, Yoo JY, Lee NI, Fujihara K |
1682 - 1689 |
Microstructure, chemistry, and tribological performance of MoSx/WSey co-sputtered composites Savan A, Haefke H, Simmonds MC, Constable CP |
1690 - 1698 |
Reactivity of Cu with poly(tetrafluoroethylene) and poly(vinyl chloride): Effect of pre- and post-metallization modification on the metal/polymer interface Perry CC, Torres J, Carlo SR, Fairbrothera DH |
1699 - 1703 |
Reactive sputter deposition of tungsten nitride thin films Baker CC, Shah SI |
1704 - 1715 |
High-rate deposition of a-SiNx : H for photovoltaic applications by the expanding thermal plasma Kessels WMM, Hong J, van Assche FJH, Moschner JD, Lauinger T, Soppe WJ, Weeber AW, Schram DC, van de Sanden MCM |
1716 - 1721 |
Temperature dependence of oxide decomposition on titanium surfaces in ultrahigh vacuum Mizuno Y, King FK, Yamauchi Y, Homma T, Tanaka A, Takakuwa Y, Momose T |
1722 - 1732 |
Approach for control of high-density plasma reactors through optimal pulse shaping Vincent TL, Raja LL |
1733 - 1737 |
Advantages of laser-acoustical leak testing for construction and operation of low-temperature installations and superconducting experiments Herz W |
1738 - 1743 |
Tribological behavior of alumina doped zinc oxide films grown by pulsed laser deposition Prasad SV, Nainaparampil JJ, Zabinski JS |
1744 - 1748 |
Effect of deposition interruption and substrate bias on the structure of sputter-deposited yttria-stabilized zirconia thin films Ruddell DE, Stoner BR, Thompson JY |
1749 - 1754 |
Effects of deposition temperature on structural defect and electrical resistivity in heteroepitaxial La0.5Sr0.5CoO3/CeO2/YSZ/Si films Chen CH, Saiki A, Wakiya N, Shinozaki K, Mizutani N |
1755 - 1758 |
Effect of substrate position in i-ZnO thin-film formation to Cu(In,Ga)Se-2 solar cell Yamaguchi T, Tanaka T, Yoshida A |
1759 - 1768 |
Ion energy distributions versus frequency and ion mass at the rf-biased electrode in an inductively driven discharge Abraham IC, Woodworth JR, Riley ME, Miller PA, Hamilton TW, Aragon BP |
1769 - 1773 |
Effects of plasma treatment on the properties of Cu/Ta/fluorinated amorphous carbon (a-C : F)/Si multilayer structure Yang SH, Kim H, Park JW |
1774 - 1778 |
Quantitative study of ion bombardment induced phase transformation of cubic boron nitride by reflective electron energy-loss spectroscopy Hui YY, Wong KW, Lau WM |
1779 - 1783 |
Growth of stoichiometric (002) ZnO thin films on Si (001) substrate by using plasma enhanced chemical vapor deposition Li BS, Liu YC, Zhi ZZ, Shen DZ, Zhang JY, Lu YM, Fan XW, Kong XG |
1784 - 1786 |
Simple method for cleaning gallium nitride (0001) Machuca F, Liu Z, Sun Y, Pianetta R, Spicer WE, Pease RFW |
1787 - 1795 |
Neutral gas temperatures measured within a high-density, inductively coupled plasma abatement device Tonnis EJ, Graves DB |
1796 - 1801 |
Epitaxial growth and dielectric properties of functionally graded (Ba1-xSrx)TiO3 thin films with stoichimetric variation Zhu X, Chan HLW, Choy CL, Wong KH |
1802 - 1807 |
Improvement of oxygen barrier of polyethylene terepthalate film by plasma-source ion implantation of carbon Yoshida M, Tanaka T, Shinohara M, Watanabe S, Lee JW, Takagi T |
1808 - 1814 |
Angular dependence of SiO2 etch rate at various bias voltages in a high density CHF3 plasma Lee GR, Hwang SW, Min JH, Moon SH |
1815 - 1823 |
Thermal stability of arc evaporated high aluminum-conteht Ti1-xAlxN thin films Horling A, Hultman L, Oden M, Sjolen J, Karlsson L |
1824 - 1827 |
Multiple phase structures of Hf silicide precipitated from Hf silicate: An atomic view Lee JH, Ichikawa M |
1828 - 1830 |
Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)(2) and Ti(i-OPr)(4) Lee JH, Cho YJ, Min YS, Kim D, Rhee SW |