Six latent curing agents were prepd. by complexing Cu(II), Ni(II) and Co(II) ions with imidazole (I) derivatives (1:4 mole ratio) in aq. soln. for 30 min. Pot life times were measured by viscosity changes (ARES rheometer) and FTIR spectra during storage. The agents were then used for curing a corn. epoxy resin in adhesive joints (Al plates) at 140 degrees C for 4 h. The joints were studied for shear strength during storage. Use of the complexes resulted in extension of the pot life time of the epoxy compn. up to 1 month for 1-Bu-I complexes or up to 3 months for 2-Et-I complexes.