Bonding AIN substrate with copper plate was performed in a N-2 atmosphere and under pressure by introducing an Ag-Cu-Ti based alloy interlayer. The microstructure of the interface was examined by means of SEM and EPMA. (Ti,A')N thin layer formed in the interfacial between AIN and interlayer alloy. The chemical bonding between AIN and (Ti,AI)N corresponds to provide adhesion of metallization. A maximum adhesion strength of 1.8kg/mm(2) was achieved. The effects of the interlayer composition on the adhesion strength of the joints were investigated.