| 학회 | 한국공업화학회 |
| 학술대회 | 2017년 가을 (11/08 ~ 11/10, 부산 벡스코(BEXCO)) |
| 권호 | 21권 2호 |
| 발표분야 | 정밀화학_포스터 |
| 제목 | 구리전해도금에서 평탄제 구조가 미치는 영향 |
| 초록 | Accelerator, suppressor, and leveler are three organic additives for Cu electrodeposition. Among these, the leveler is considered to be important when one needs to fill high aspect ratio via. Convection-dependent adsorption, a distinctive feature of the leveler, makes the leveler a unique additive. However, there have been few reports about the structure and property relationship of levelers. With the experience of having synthesized a new leveler in hand, we synthesized three new levelers having different structures. Their electrochemical properties were examined and the results indicated the structures of levelers have considerable effects. The gap-filling tests for TSV-like trenches were also examined. |
| 저자 | 이윤재, 이명현, 김재정, 김영규 |
| 소속 | 서울대 |
| 키워드 | 평탄제; 구리전해도금; 실리콘관통전극; 구조활성관계; 교반의존흡착 |
