1 - 7 |
Traps centers impact on Silicon nanocrystal memories given by Random Telegraph Signal and low frequency noise Trabelsi M, Militaru L, Sghaier N, Souifi A, Yacoubi N |
8 - 12 |
Output power enhancements of nitride-based light-emitting diodes with inverted pyramid sidewalls structure Chang LC, Kuo CH, Kuo CW |
13 - 17 |
Temperature model for Ge2Sb2Te5 phase change memory in electrical memory device Cai DL, Song ZT, Chen HP, Chen XG |
18 - 22 |
Microwave noise modeling of FinFETs Crupi G, Caddemi A, Schreurs DMMP, Wiatr W, Mercha A |
23 - 30 |
Comprehensive numerical simulation of threshold-voltage transients in nitride memories Mauri A, Amoroso SM, Compagnoni CM, Maconi A, Spinelli AS |
31 - 34 |
Investigation of GaN-based light-emitting diodes using double photonic crystal patterns Huang HW, Lai FI, Kuo SY, Huang JK, Lee KY |
35 - 39 |
On relationship between the field at an autoemitter top, anode voltage and cathode geometry Stetsenko BV, Shchurenko AI |
40 - 46 |
A unified short-channel compact model for cylindrical surrounding-gate MOSFET Cousin B, Reyboz M, Rozeau O, Jaud MA, Ernst T, Jomaah J |
47 - 55 |
Optimization of SiGe bandgap-based circuits for up to 300 degrees C operation Thomas DB, Najafizadeh L, Cressler JD, Moen KA, Lourenco N |
56 - 59 |
Implantation angle periphery effects on non-alloyed Si-implanted ohmic contacts for AlGaN/GaN high electron mobility transistors Kocan M, Recht F, Umana-Membreno GA, Kilburn MR, Nener BD, Mishra UK, Parish G |
60 - 67 |
Physical limitations of the diffusive approximation in semiconductor device modeling Mnatsakanov TT, Tandoev AG, Levinshtein ME, Yurkov SN |
68 - 72 |
Effects of Ge-72/Ge-74 preamorphization combined with sub-keV boron implantation in pMOSFET fabrication Chen LC, Chen SF, Wu MC |
73 - 78 |
Over 1000 V/30 mA operation GaN-on-Si MOSFETs fabricated on Si substrates Niiyama Y, Li ZD, Chow TP, Li JA, Nomura T, Kato S |
79 - 84 |
Thermal measurements and analysis of AlGaInP/GaInP MQW red LEDs with different chip sizes and substrate thicknesses Lee HK, Lee DH, Song YM, Lee YT, Yu JS |
85 - 88 |
A highly-compact packaging design for improving the thermal performance of multi-finger InGaP/GaAs collector-up HBTs Tseng HC, Chen JY |
89 - 94 |
Direct determination of threshold condition in DG-MOSFETs from the g(m)/I-D curve Cunha AIA, Pavanello MA, Trevisoli RD, Galup-Montoro C, Schneider MC |
95 - 99 |
Comparative study of quasi-static and normal capacitance-voltage characteristics in amorphous Indium-Gallium-Zinc-Oxide thin film transistors Lee S, Jeon YW, Kim S, Kong D, Kim DH, Kim DM |
100 - 103 |
Studies on vacuum deposited p-ZnTe/n-CdTe heterojunction diodes Rao GK, Bangera KV, Shivakumar GK |
104 - 110 |
Measurements of charge carrier mobilities and drift velocity saturation in bulk silicon of < 1 1 1 > and < 1 0 0 > crystal orientation at high electric fields Becker J, Fretwurst E, Klanner R |
111 - 115 |
Channel scaling of hybrid GaN MOS-HEMTs Li ZD, Chow TP |
116 - 119 |
Transconductance characteristics and plasma oscillations in nanometric InGaAs field effect transistors Millithaler JF, Pousset J, Reggiani L, Marinchio H, Varani L, Palermo C, Ziade P, Mateos J, Gonzalez T, Perez S |
120 - 129 |
Nonlinear electron properties of an InGaAs/InAlAs-based ballistic deflection transistor: Room temperature DC experiments and numerical simulations Kaushal V, Iniguez-de-la-Torre I, Margala M |
130 - 134 |
Electrical characteristics of nickel suicide-silicon heterojunction in suspended silicon nanowires Hong SH, Kang MG, Kim BS, Kim DS, Ahn JH, Whang D, Sull SH, Hwang SW |
135 - 140 |
Dynamic model of AlGaN/GaN HFET for high voltage switching Koudymov A |
141 - 147 |
A self-consistent algorithm to extract interface trap states of MOS devices on alternative high-mobility substrates Satter MM, Islam AE, Varghese D, Alam MA, Haque A |
148 - 154 |
A surface potential based drain current model for asymmetric double gate MOSFETs Dutta P, Syamal B, Mohankumar N, Sarkar CK |
155 - 158 |
Improved performance of mixed single layer top-emission organic light emitting devices using capping layer Wang ZK, Naka S, Okada H |
159 - 162 |
In-cell adaptive touch technology for a flexible e-paper display Lee JK, Kim SS, Park YI, Kim CD, Hwang YK |
163 - 167 |
High field-effect mobility normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate by selective area growth technique Kambayashi H, Satoh Y, Kokawa T, Ikeda N, Nomura T, Kato S |
168 - 174 |
Resistance change in memory structures integrating CuTCNQ nanowires grown on dedicated HfO2 switching layer Muller C, Deleruyelle D, Muller R, Thomas M, Demolliens A, Turquat C, Spiga S |
175 - 178 |
Effects of residual copper selenide on CuInGaSe2 solar cells Hsieh TP, Chuang CC, Wu CS, Chang JC, Guo JW, Chen WC |
179 - 184 |
Combined effect of bias and annealing in gamma and neutron radiation assurance tests of SiGe bipolar transistors for HEP applications Ullan M, Diez S, Lozano M, Pellegrini G, Knoll D, Heinemann B |
185 - 190 |
Titanium and silver contacts on thermally oxidized titanium chip: Electrical and gas sensing properties Hossein-Babaei F, Rahbarpour S |
191 - 195 |
SET/RESET properties dependence of phase-change memory cell on thickness of phase-change layer Qu LW, Miao XS, Sheng JJ, Li Z, Sun JJ, An P, Huang JD, Yang DH, Liu C |
196 - 200 |
Transient electroluminescence determination of carrier mobility and charge trapping effects in heavily doped phosphorescent organic light-emitting diodes Lin MT, Li MH, Chen WH, Omary MA, Shepherd ND |
201 - 206 |
AlGaN/GaN hybrid MOS-HEMT analytical mobility model Perez-Tomas A, Fontsere A |
207 - 210 |
Degradation evaluation of poly-Si TFTs by comparing normal and reverse characteristics and behavior analysis of hot-carrier degradation Kasakawa T, Tabata H, Onodera R, Kojima H, Kimura M, Hara H, Inoue S |
211 - 213 |
A mechanism for asymmetric data writing failure Lee MJ, Park KW |
214 - 218 |
Mobility degradation and transistor asymmetry impact on field effect transistor access resistances extraction Tinoco JC, Martinez-Lopez AG, Raskin JP |
219 - 222 |
Leakage current mechanisms in sub-50 nm recess-channel-type DRAM cell transistors with three-terminal gate-controlled diodes Chung EA, Kim YP, Nam KJ, Lee S, Min JY, Shin YG, Choi S, Jin G, Moon JT, Kim S |