855 - 855 |
Silicon on insulator technology and devices - Foreword Cristoloveanu S |
857 - 865 |
Nanoscale SOI MOSFETs: a comparison of two options Walls TJ, Sverdlov VA, Likharev KK |
867 - 875 |
Device design and manufacturing issues for 10 nm-scale MOSFETs: a computational study Hasan S, Wang J, Lundstrom M |
877 - 885 |
Blue sky in SOI: new opportunities for quantum and hot-electron devices Luryi S, Zaslavsky A |
887 - 895 |
Emerging silicon-on-nothing (SON) devices technology Monfray S, Skotnicki T, Fenouillet-Beranger C, Carriere N, Chanemougame D, Morand Y, Descombes S, Talbot A, Dutartre D, Jenny C, Mazoyer P, Palla R, Leverd F, Le Friec Y, Pantel R, Borel S, Louis D, Buffet N |
897 - 905 |
Multiple-gate SOI MOSFETs Colinge JP |
907 - 917 |
Advanced SOI MOSFETs with buried alumina and ground plane: self-heating and short-channel effects Oshima K, Cristoloveanu S, Guillaumot B, Iwai H, Deleonibus S |
919 - 926 |
A process/physics-based compact model for nonclassical CMOS device and circuit design Fossum JG, Ge L, Chiang MH, Trivedi VP, Chowdhury MM, Mathew L, Workman GO, Nguyen BY |
927 - 936 |
Low field electron mobility in ultra-thin SOI MOSFETs: experimental characterization and theoretical investigation Esseni D, Sangiorgi E |
937 - 945 |
Double gate silicon on insulator transistors. A Monte Carlo study Gamiz F, Roldan JB, Godoy A, Carceller JE, Cartujo P |
947 - 959 |
Laterally asymmetric channel engineering in fully depleted double gate SOI MOSFETs for high performance analog applications Kranti A, Chung TM, Flandre D, Raskin JP |
961 - 967 |
Requirements for ultra-thin-film devices and new materials for the CMOS roadmap Fenouillet-Beranger C, Skotnicki T, Monfray S, Carriere N, Boeuf F |
969 - 978 |
Modeling the floating-body effects of fully depleted, partially depleted, and body-grounded SOI MOSFETs Chan M, Su P, Wan H, Lin CH, Fung SKH, Niknejad AM, Hu CM, Ko PK |
979 - 984 |
Reduction in threshold voltage fluctuation in fully-depleted SOI MOSFETs with back gate control Numata T, Noguchi M, Takagi S |
985 - 997 |
Low frequency noise and hot-carrier reliability in advanced SOI MOSFETs Dieudonne F, Haendler S, Jomaah J, Balestra F |
999 - 1006 |
Fully depleted SOI process and device technology for digital and RF applications Ichikawa F, Nagatomo Y, Katakura Y, Itoh M, Itoh S, Matsuhashi H, Ichimori T, Hirashita N, Baba S |
1007 - 1015 |
New SOI lateral power devices with trench oxide Park JM, Wagner S, Grasser T, Selberherr S |
1017 - 1025 |
Composite ULP diode fabrication, modelling and applications in multi-V-th FD SOICMOS technology Levacq D, Liber C, Dessard V, Flandre D |
1027 - 1044 |
Analysis of heavy-ion induced charge collection mechanisms in SOI circuits Schwank JR, Ferlet-Cavrois V, Dodd PE, Shaneyfelt MR, Vizkelethy G, Paillet P, Flament O |
1045 - 1054 |
Total ionizing dose damage in deep submicron partially depleted SOI MOSFETs induced by proton irradiation Simoen E, Rafi JM, Mercha A, Claeys C |
1055 - 1063 |
Smart-Cut (R) technology: from 300 mm ultrathin SOI production to advanced engineered substrates Maleville C, Mazure C |
1065 - 1072 |
Qualification of 300 mm SOICMOS substrate material: readiness for development and manufacturing Hovel H, Almonte M, Tsai P, Lee JD, Maurer S, Kleinhenz R, Schepis D, Murphy R, Ronsheim P, Domenicucci A, Bettinger J, Sadana D |
1073 - 1078 |
Two-dimensional simulation of pattern-dependent oxidation of silicon nanostructures on silicon-on-insulator substrates Uematsu M, Kageshima H, Shiraishi K, Nagase M, Horiguchi S, Takahashi Y |