L1 - L5 |
Atomic-level robustness of the Si(100)-2X1 : H surface following liquid phase chemical treatments in atmospheric pressure environments Baluch AS, Guisinger NP, Basu R, Foley ET, Hersam MC |
445 - 451 |
Effect of N-2 plasma on yttrium oxide and yttrium-oxynitride dielectrics Niu D, Ashcraft RW, Hinkle C, Parsons GN |
452 - 460 |
Forced convection magnetoelectroplating for enhanced semiconductor metallization Said RA |
461 - 464 |
Chemical-beam deposition of GaN films on Si(111) from diethylazidogallium methylhydrazine adduct Sung MM, Kim CG, Kim Y |
465 - 471 |
Effects of thermal annealing Of W/SiO2 multilayer Bragg reflectors on resonance characteristics of film bulk acoustic resonator devices with cobalt electrodes Yim M, Kim DH, Chai D, Yoon G |
472 - 476 |
Cathode glow polymerization of trimethylsilane Yasuda H, Yu QS |
477 - 481 |
Ionized magnetron sputter deposition of hard nanocomposite TiN/amorphous-silicon nitride films Phinichka N, Chandra R, Barber ZH |
482 - 486 |
Thickness measurements by quartz microbalance during thin-film growth by organic-molecular-beam deposition Campione M, Cartotti M, Pinotti E, Sassella A, Borghesi A |
487 - 493 |
Hydrogenated-amorphous carbon nitride films formed from the dissociative excitation reaction of CH3CN with the microwave-discharge flow of Ar: Correlation of the [N]/([N]+[C]) ratio with the relative number densities of the CH(A(2)Delta) and CN(B-2 Sigma(+)) states Ito H, Miki H, Namiki KC, Ito N, Saitoh H, Suzuki T, Yatsui K |
494 - 499 |
Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide Cheng YL, Wang YL, Chen HW, Lan JL, Liu CP, Wu SA, Wu YL, Lo KY, Feng MS |
500 - 510 |
Properties of C4F8 inductively coupled plasmas. l. Studies of Ar/c-C4F8 magnetically confined plasmas for etching of SiO2 Li X, Ling L, Hua XF, Oehrlein GS, Wang YC, Vasenkov AV, Kushner MJ |
511 - 530 |
Properties of c-C4F8 inductively coupled plasmas. II. Plasma chemistry and reaction mechanism for modeling of Ar/c-C4F8/O-2 discharges Vasenkov AV, Li X, Oehrlein GS, Kushner MJ |
531 - 533 |
Electron-cyclotron-resonance plasma etching of the ZnO layers grown by molecular-beam epitaxy Ogata K, Honden T, Tanite T, Komuro T, Koike K, Sasa S, Inoue M, Yano M |
534 - 544 |
Extraction of negative ions from pulsed electronegative inductively coupled plasmas having a radio-frequency substrate bias Subramonium P, Kushner MJ |
545 - 552 |
Numerical simulation of the thermal-mechanical process of high current pulsed electron beam treatment Zou JX, Qin Y, Dong C, Wang XG, Wu AM, Hao SZ |
553 - 563 |
Monitoring chamber walls coating deposited during plasma processes: Application to silicon gate etch processes Joubert O, Cunge G, Pelissier B, Vallier L, Kogelschatz M, Pargon E |
564 - 569 |
Effects of germanium content on sol-gel GeO2/gamma-glycidoxypropyltri methoxysilane hybrid planar waveguides prepared at low temperature Que WX, Hu X |
570 - 577 |
Composition, structural, and electrical properties of fluorinated silicon-nitride thin films grown by remote plasma-enhanced chemical-vapor deposition from SiF4/NH3 mixtures Fandino J, Ortiz A, Rodriguez-Fernandez L, Alonso JC |
578 - 593 |
Effects of atomic hydrogen on the selective area growth of Si and Si1-xGex thin films on Si and SiO2 surfaces: Inhibition, nucleation, and growth Schroeder TW, Lam AM, Ma PF, Engstrom JR |
594 - 597 |
In situ photoemission study of a Pr2O3 thin film on GaAs(111) Wu JX, Wang ZM, Li S, Ma MS |
598 - 601 |
Etching mechanism of a GaN/InGaN/GaN heterostructure in Cl-2- and CH4-based inductively coupled plasmas Kim HK, Lin H, Ra Y |
602 - 605 |
Template stripping using cold welding Blackstock JJ, Li ZY, Jung GY |
606 - 615 |
Etching of high aspect ratio structures in Si using SF6/O-2 plasma Gomez S, Belen RJ, Kiehlbauch M, Aydil ES |
616 - 623 |
Deposition of Hf-silicate gate dielectric on SixGe1-X(100): Detection of interfacial layer growth Addepalli S, Sivasubramani P, El-Bouanani M, Kim MJ, Gnade BE, Wallace RM |
624 - 635 |
Analysis of the chemical composition and deposition mechanism, of the SiOx-Cl-y layer on the plasma chamber walls during silicon gate etching Kogelschatz M, Cunge G, Sadeghi N |
636 - 639 |
Oxygen plasma rapid thermal annealing to improve the electrical properties of Pt-SrBi2Nb2O9-SiO2_Si gate structure Kim IS, Kim SI, Kim YT |
640 - 645 |
SiBCN synthesis by high-dose N++C++BF2+ ion implantation Cervera M, Hernandez MJ, Piqueras J, Morant C, Prieto P, Elizalde E, Sanz JM |
646 - 649 |
Physical and mechanical properties of sputtered Ta-Si-N films with a high (>= 40 at %) content of Si Zeman H, Musil J, Zeman P |
650 - 654 |
Electron backscattered diffraction study of poly-Si by Ni-mediated crystallization of amorphous silicon using a SiO2 nanocap Chang YJ, Oh JH, Kim KH, Jang J, Kim DI, Oh KH |
655 - 660 |
Metal-insulator-metal capacitors using Y2O3 dielectric grown by pulsed-injection plasma enhanced metalorganic chemical vapor deposition Durand C, Vallee C, Loup V, Salicio O, Dubourdieu C, Blonkowski S, Bonvalot M, Holliger P, Joubert O |
661 - 669 |
Angular dependence of etch rates in the etching of poly-Si and fluorocarbon polymer using SF6, C4F8, and O-2 plasmas Min JH, Lee GR, Lee JK, Moon SH, Kim CK |
670 - 675 |
Femtosecond pulsed laser deposition of amorphous, ultrahard boride thin films Stock M, Molian P |
676 - 682 |
Effects of the insertion of a thick Sp2 buffer layer on the adhesion of cBN-rich film Wong SF, Ong CW, Pang GKH, Baba-Kishi KZ, Lau WM |
683 - 688 |
Thioethanol on Cu(111) at room temperature: A near edge x-ray absorption fine structure and x-ray photoelectron spectroscopy study Syed JA, Sardar SA, Yagi S, Tanaka K |
689 - 697 |
Investigation and modeling of plasma-wall interactions in inductively coupled fluorocarbon plasmas Joseph EA, Zhou B, Sant SP, Overzet LJ, Goeckner MJ |
698 - 704 |
Phase transition behavior of reactive sputtering deposited Co-N thin films using transmission electron microscopy Fang JS, Yang LC, Hsu CS, Chen GS, Lin YW, Chen GS |
705 - 710 |
Outgassing properties of the spallation neutron source, ring vacuum chambers coated with titanium nitride He P, Hseuh HC, Mapes M, Todd R, Weiss D, Wilson D |
711 - 718 |
Spectroscopic ellipsometry characterization of ZrO2 films on Si(100) deposited by high-vacuum-metalorganic chemical vapor deposition Song Z, Rogers BR, Theodore ND |
719 - 724 |
Phase and structural characterization of vanadium oxide films grown on amorphous SiO2/Si substrates Youn DH, Kim HT, Chae BG, Hwang YJ, Lee JW, Maeng SL, Kang KY |
725 - 733 |
Optical characteristics and color of TiN/SiN1.3 nanocomposite coatings Jedrzejowski P, Baloukas B, Klemberg-Sapieha JE, Martinu L |
734 - 734 |
High vacuum end cap design for use with quartz tubes Weyburne DW, Paduano OS |
735 - 738 |
Construction of a variable aperture cell for source flux control in a molecular-beam epitaxy environment Mattord TJ, Oye MM, Gotthold D, Hansing C, Holmes AL, Streetman BG |
739 - 739 |
Extremely low-outgassing material: 0.2% beryllium copper alloy (vol 22, pg 181, 2004) Watanabe F |
742 - 742 |
Papers from the Eleventh Canadian Semiconductor Technology Conference -18-22 August 2003 - The Fairmont Chateau Laurier Hotel - Ottawa, Canada - Preface Gupta JA, Xu DX |
743 - 746 |
Nano patterning on optical fiber and laser diode facet with dry resist Kelkar PS, Beauvais J, Lavallee E, Drouin D, Cloutier M, Turcotte D, Yang P, Mun LK, Legario R, Awad Y, Aimez V |
747 - 751 |
Cold wall chemical vapor deposition of single walled carbon nanotubes Finnie P, Bardwell J, Tsandev I, Tomlinson M, Beaulieu M, Fraser J, Lefebvre J |
752 - 754 |
Numerical simulations of variable range hopping conductivity in deoxyguanosine deoxyribose nucleic acid nucleoside films Singh MR, Tsang CM |
755 - 759 |
Variable current transport in polymer thin film transistors Marinov O, Deen MJ, Yu JF, Vamvounis G, Holdcroft S, Woods W |
760 - 763 |
Oligo-p-phenylevinylene organic thin-film transistors with chemically modified dielectric surfaces Gorjanc TC, Levesque I, D'iorio M |
764 - 767 |
Microcavity organic light emitting diodes with double sided light emission of different colors Liu X, Poitras D, Tao Y, Py C |
768 - 770 |
Fabrication of short channel organic thin film transistors by Si-etching method Chen Y, Zhu WW, Xiao S, Shih I |
771 - 775 |
Organometallic vapor phase epitaxy of GaAs1-N-x(x) alloy layers on GaAs(001): Nitrogen incorporation and lattice parameter variation Beaudry JN, Masut RA, Desjardins P, Wei R, Chicoine M, Bentoumi G, Leonelli R, Schiettekatte F, Guillon S |
776 - 780 |
Empirical tight-binding calculations of the electronic structure of dilute III-V-N semiconductor alloys Turcotte S, Shtinkov N, Desjardins P, Masut RA, Leonelli R |
781 - 787 |
High-speed Si resonant cavity enhanced photodetectors and arrays Unlu MS, Emsley MK, Dosunmu OI, Muller P, Leblebici Y |
788 - 791 |
1.5 mu m to 0.87 mu m optical upconversion using wafer fusion technology Luo H, Ban D, Liu HC, Springthorpe AJ, Wasilewski ZR, Buchanan M, Glew R |
792 - 795 |
Growth of InGaN self-assembled quantum dots and their application to photodiodes Ji LW, Su YK, Chang SJ, Tsai SI, Hung SC, Chuang RW, Fang TH, Tsai TY |
796 - 799 |
Optical switching in InGaAsP waveguides using localized index gradients Abdalla S, Ng S, Celo D, El-Mougy S, Smy I, Syrett B, Barrios P, Delage A, Golub I, Janz S, McKinnon R, Poole P, Raymond S |
800 - 802 |
Optical modulator in silicon-on-insulator with a low thermal signature Waldron PD, Jessop PE, Yuen AP, Winchiu L, Chyurlia P, Tarr NG, Smy TJ, Golub I, Xu DX, Janz S |
803 - 806 |
Influence of the electrical contact on the reliability of InP-based ridge waveguide distributed feedback semiconductor diode lasers for telecommunications applications Zhang S, Boudreau MG, Kuchibhatla R, Tao Y, Das SR, Griswold EM, Sharma U |
807 - 810 |
Study of AIGaInP multiquantum-well/double heterostructure light-emitting diodes with in-added GaP window layer regrown by antimony-based liquid phase epitaxy Chang LB, Kuei PY, Hsieh LZ, Chang LY, Lin RM |
811 - 815 |
Modeling of mushroom waveguide photodetector El-Batawy YM, Deen MJ |
816 - 820 |
Electrode fabrication for high-speed polarization mode converter Meng X, Zhang S, Chen C, Poirier M, Shepherd FR, Das SR |
821 - 825 |
Suitability of II-VI semiconductors for photonic applications: Common-anion versus common-cation superlattices Tit N |
826 - 830 |
Optical add and drop multiplexer using on-chip integration of planar light circuits and optical microelectromechanical system switching Liu XY, Kubby J, Chen JK, Diehl J, Feinberg K, German K, Gulvin P, Herko L, Jia N, Lin PY, Ma J, Meyers J, Nystrom P, Wang YR |
831 - 836 |
Electrokinetic movement of micro-objects in fluids using microelectromechanical system electrode arrays Ellerington N, Hubbard T, Kujath M |
837 - 841 |
Dry release of polymer structures with anti-sticking layer Cheng MC, Gadre AP, Garra JA, Nijdam AJ, Luo C, Schneider TW, White RC, Currie JF, Paranjape M |
842 - 846 |
Fabrication of a self-absorbing, self-supported complementary metal-oxide-semiconductor compatible micromachined bolometer Ahmed AHZ, Tait RN |
847 - 850 |
Copper coplanar waveguides in Si substrates for 10 GHz applications Amaya RE, Levenets V, Tarr NG, Plett C |
851 - 855 |
High-k titanium silicate thin films grown by reactive magnetron sputtering for complementary metal-oxide-semiconductor applications Brassard D, Sarkar DK, El Khakani MA, Ouellet L |
856 - 858 |
Low-temperature stress-assisted germanium-induced crystallization of silicon-germanium alloys on flexible polyethylene terephtalate substrates Hekmatshoar B, Shahrjerdi D, Mohajerzadeh S, Khakifirooz A, Robertson M, Tonita A, Bennett JC |
859 - 864 |
Optical switching of vanadium dioxide thin films deposited by reactive pulsed laser deposition Soltani M, Chaker M, Haddad E, Kruzelecky RV, Nikanpour D |
865 - 869 |
Facet coatings for nonhermetically packaged lasers Caballero JA, He C, Djavani-Tabrizi S, Yin T, Mallard R, Das SR |
870 - 873 |
Excimer laser annealing of p-type perovskite thin films Du X, Dubowski JJ, Post M, Wang D, Tunney J |
874 - 878 |
Passivation of GaAs using P2S5/(NH4)(2)S+Se and (NH4)(2)S+Se Fanaei T, Aktik C |
879 - 882 |
Optical and electrical properties of sputtered vanadium oxide films Gan FY, Laou P |
883 - 886 |
Optical and compositional characterization of SiOxNy and SiOx thin films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition Roschuk T, Wojcik J, Tan X, Davies JA, Mascher P |
887 - 890 |
Laser-induced selective area tuning of GaAs/AlGaAs quantum well microstructures for two-color IR detector operation Dubowski JJ, Song CY, Lefebvre J, Wasilewski Z, Aers G, Liu HC |
891 - 893 |
Study of lateral-carrier transport in InAs quantum-dot heterostructures by optical spectroscopy Lin RM, Cheng CC, Shen HT, Nee TE |
894 - 896 |
Quantum states in a crossed wire system Paranjape VV |
897 - 901 |
Interface layers in In0.532Ga0.468As/InP superlattices Rowell NL, Yu G, Lockwood DJ, Poole PJ |
902 - 907 |
Use of the focused ion beam to locate failure sites within electrically erasable read only memory microcircuits Haythornthwaite R, Nxumalo J, Phaneuf MW |
908 - 911 |
Characterization GaAs1-xNx epitaxial layers by ion beam analysis Wei P, Chicoine M, Gujrathi S, Schiettekatte F, Beaudry JN, Masut RA, Desjardins P |
912 - 915 |
Metalorganic vapor phase diffusion using dimethylzinc. Part 1: Analysis of the reproducibility of the resulting diffusion profile as measured by secondary ion mass spectrometry Hampel CA, Blaauw C, Calder ID, Glew R, Macquistan D, Bryskiewicz T, Guillon S |
916 - 920 |
Metalorganic vapor phase diffusion using DMZn Part II: Determination of the interstitial zinc charge state from secondary ion mass spectroscopy measurements using the Boltzmann-Matano technique Hampel CA, Blaauw C, Haysom JE, Glew R, Calder ID, Guillon S, Bryskiewicz T, Puetz N |
921 - 924 |
Photoluminescence measurements of Er-doped chalcogenide glasses Allen TW, Hawkeye MM, Haugen CJ, DeCorby RG, McMullin JN, Tonchev D, Koughia K, Kasap SO |
925 - 929 |
Implant isolation in an indium phosphide optoelectronic device: A scanning spreading resistance microscopy study St Dixon-Warren J, Haysom JE, Betty I, Lu J, Hewitt K |
930 - 934 |
Focused ion beam and transmission electron microscopy method for root cause analysis of InP ridge laser devices Griswold EM, Sharma U, Phaneuf MW |
935 - 938 |
Optical phonons in InSb1-xAsx/InSb Rowell NL, Lockwood DJ, Yu G, Gao YZ, Gong XY, Aoyama M, Yamaguchi T |
939 - 942 |
Dopant layer abruptness in strained Si1-xGex heterostructures Rowell NL, Houghton DC, Berbezier I, Ronda A, Webb D, Ward M |
943 - 947 |
Raman and transmission electron microscopy study of disordered silicon grown by molecular beam epitaxy Tay L, Lockwood DJ, Baribeau JM, Wu X, Sproule GI |
948 - 953 |
Resolution enhancement in probing of high-speed integrated circuits using dynamic electrostatic force-gradient microscopy Weng Z, Kaminski I, Bridges GE, Thomson DJ |
954 - 961 |
Energy band gaps of InN containing oxygen and of the In(x)AI(1-x)N interface layer formed during InN film growth Alexandrov D, Scott K, Butcher A, Wintrebert-Fouquet M |
962 - 965 |
Single crystal growth of Ge1-xSix alloys using the traveling solvent method Labrie D, George AE, Jamieson M, Obruchkov S, Healey JP, Paton BE, Saghir MZ |
966 - 970 |
Stress-assisted nickel-induced crystallization of silicon on glass Hashemi P, Derakhshandeh J, Mohajerzadeh S, Robertson M, Tonita A |
971 - 974 |
Two-dimensional a-Si : H based n-i-p sensor array Chang JH, Vygranenko Y, Nathan A |
975 - 980 |
Charge collection and absorption-limited x-ray sensitivity of pixellated x-ray detectors Kabir MZ, Kasap SO |
981 - 986 |
Amorphous silicon shift registers for display drivers Kumar A, Sambandan S, Sakariya K, Servati P, Nathan A |
987 - 990 |
Reset noise in active pixel image sensors Lai J, Nathan A |
991 - 995 |
Highly conductive n(+) hydrogenated microcrystalline silicon and its application in thin film transistors Lee CH, Striakhilev D, Nathan A |
996 - 1000 |
Deep-ultraviolet-induced damage of charge coupled device sensors Li F, Nathan A, Nixon O |
1001 - 1004 |
Analysis and characterization of self-compensating current programmed a-Si : H active matrix organic light-emitting diode pixel circuits Sakariya K, Sambandan S, Servati P, Nathan A |
1005 - 1009 |
X-ray-induced recombination effects in a-Se-based x-ray photoconductors used in direct conversion x-ray sensors Fogal B, Kabir MZ, O'Leary SK, Johanson RE, Kasap SO |
1010 - 1014 |
Noise performance of a current-mediated amplified pixel for large-area medical imaging Karim KS, Nathan A |
1015 - 1019 |
Fabrication and characterization of amorphous Si/crystalline Si heterojunction devices for photovoltaic applications Baroughi MF, Jeyakumar R, Vygranenko Y, Khalvati F, Sivoththaman S |
1020 - 1022 |
InGaN/AlGaN near-ultraviolet multiple quantum well light-emitting diodes with p-InGaN tunneling contact layer Chen CH, Chang SJ, Su YK |
1023 - 1026 |
Monocrystalline CulnSe(2) photovoltaic cell of superior performance Du H, Shih I, Champness CH |
1027 - 1030 |
Fabrication of (NH4)(2)S passivated GaAs metal-insulator-semiconductor devices using low-frequency plasma-enhanced chemical vapor deposition Jaouad A, Aimez V, Aktik C, Bellatreche K, Souifi A |
1031 - 1035 |
Temperature distribution and heating in multiple emitter SiGeHBTs McAlister SP, McKinnon WR, Kovacic SJ, Lafontaine H |
1036 - 1039 |
InVerse modeling of delta doped pseudomorphic high electron, mobility transistors Mishra M, Kumar MJ, Singh Y, Shukla SR, Vyas HP, Rawal DS, Naik A, Sharma HS, Sehgal BK, Gulati R |
1040 - 1043 |
Arrays of holes fabricated by electron-beam lithography combined with image reversal process using nickel pulse reversal plating Awad Y, Lavallee E, Lau KM, Beauvais J, Drouin D, Cloutier M, Turcotte D, Yang P, Kelkar P |
1044 - 1047 |
Direct UV patterning of waveguide devices in AS(2)Se(3) thin films Bryce RM, Nguyen HT, Nakeeran P, DeCorby RG, Dwivedi PK, Haugen CJ, McMullin JN, Kasap SO |
1048 - 1053 |
Thick film resist lithography for a-Si : H devices with high topography and long dry etch processes Chan I, Nathan A |
1054 - 1057 |
Etching of gain-coupled gratings into a multi-quantum-well laser with selective wet etches Finlay R |
1058 - 1061 |
Inductively coupled plasma etching of GaAs low loss waveguides for a traveling waveguide polarization converter, using chlorine chemistry Lu J, Meng X, SpringThorpe AJ, Shepherd FR, Poirier M |
1062 - 1066 |
Techniques for achieving low leakage current in dry etched InGaAs waveguide PIN detectors Qian YYH, An S, Betty I, Rousina-Webb R, Griswold E, Foster R, Driad R |
1067 - 1072 |
Polymethylmethacry ate membrane for fluid encapsulation and release in microfluidic systems Srivastava YN, Gadre AP, Hylton T, Monica AH, Schneider TW, White RC, Paranjape M, Currie JF |
1073 - 1078 |
Analysis of step-based silicon surfaces at facet boundaries during wet anisotropic etching Stateikina I, Elalamy MZ, Landsberger LM, Kahrizi M |
1079 - 1082 |
Process for uniformly electroplating a patterned wafer with electrically isolated devices Zhang S, Meng X, Zheng X, Das SR, Shepherd F |