3 - 8 |
Properties of free-standing 3C-SiC monocrystals grown on undulant-Si(001) substrate Nagasawa H, Yagi K, Kawahara T, Hatta N |
9 - 12 |
Investigation of mass transport during SiCPVT growth using digital X-ray imaging, C-13 labeling of source material and numerical modeling Wellmann PJ, Herro Z, Selder M, Durst F, Pusche R, Hundhausen M, Ley L, Winnacker A |
13 - 16 |
Stress analysis of SiC bulk single crystal growth by sublimation method Nishizawa SIC, Michikawa Y, Kato T, Hirose F, Oyanagi N, Arai K |
17 - 20 |
On the early stages of sublimation growth of 4H-SiC using 8 degrees off-oriented substrates Schulz D, Lechner M, Rost HJ, Siche D, Wollweber J |
21 - 24 |
Growth of high quality p-type 4H-SiC substrates by HTCVD Sundqvist B, Ellison A, Jonsson A, Henry A, Hallin C, Bergman JP, Magnusson B, Janzen E |
25 - 28 |
Towards a continuous feeding of the PVT growth process: an experimental investigation Chaussende D, Baillet F, Charpentier L, Pernot E, Pons M, Madar R |
29 - 32 |
Growth of faceted free-spreading SiC bulk crystals by sublimation Mokhov EN, Ramm MG, Ramm MS, Roenkov AD, Vodakov YA, Karpov SY, Makarov YA, Helava H |
33 - 38 |
HTCVD grown semi-insulating SiC substrates Ellison A, Magnusson B, Son NT, Storasta L, Janzen E |
39 - 44 |
Sublimation-grown semi-insulating SIC for high frequency devices Muller SG, Brady MF, Brixius WH, Glass RC, Hobgood HM, Jenny JR, Leonard RT, Malta DP, Powell AR, Tsvetkov VF, Allen ST, Palmour JW, Carter CH |
45 - 50 |
Defects in semi-insulating SiC substrates Son NT, Magnusson B, Zolnai Z, Ellison A, Janzen E |
51 - 54 |
Preparation of semi-insulating silicon carbide by vanadium doping during PVT bulk crystal growth Bickermann M, Hofmann D, Straubinger TL, Weingartner R, Winnacker A |
55 - 58 |
PVT growth of p-type and semi-insulating 2-inch 6H-SiC crystals Rasp M, Straubinger TL, Schmitt E, Bickermann M, Reshanov S, Sadowski H |
59 - 62 |
Photoluminescence and thermally stimulated luminescence in semi-insulating SiC Suleimanov YM, Lulu S, Tarasov I, Ostapenko S, Heydemann VD, Roth MD, Kordina O, MacMillan MF |
63 - 66 |
Growth of phosphorus-doped 6H-SiC single crystals by the modified Lely method Semmelroth K, Schmid F, Karg D, Pensl G, Maier M, Greulich-Weber S, Spaeth JM |
67 - 70 |
Effective increase of single-crystalline yield during PVT growth of SiC by tailoring of radial temperature gradient Herro Z, Bickermann M, Epelbaum BM, Masri P, Winnacker A |
71 - 74 |
Uniformization of radial temperature gradient in sublimation growth of SiC Tanaka H, Nishiguchi T, Sasaki M, Ohshima S, Nishino S |
75 - 78 |
Effect of ambient on 4H-SiC bulk crystals grown by sublimation Ciechonski RR, Yakimova R, Syvajarvi M, Janzen E |
79 - 82 |
Continuous growth of SiC single crystal from ultrafine particle precursor Yamada Y, Sagawa K, Nakashima S |
83 - 86 |
Defect reduction in SiC crystals grown by the modified Lely method Anikin MM, Pons M, Pernot E, Madar R |
87 - 90 |
A study of HTCVD renewing of the SiC polycrystalline source during the PVT process Charpentier L, Baillet F, Chaussende D, Pernot E, Pons M, Madar R |
91 - 94 |
Properties of nitrogen-doped 4H-SiC single crystals grown by physical vapour transport Rost HJ, Irmscher K, Doerschel J, Siche D, Schulz D, Wollweber J |
95 - 98 |
Morphological features of sublimation-grown 4H-SiC layers Schulz D, Doerschel J |
99 - 102 |
Graphitization of the seeding surface during the heating stage of SiCPVT bulk growth Drachev RV, Cherednichenko DI, Khlebnikov II, Khlebnikov YI, Sudarshan TS |
103 - 106 |
Heat transfer modeling of a new crystal growth process Baillet F, Chaussende D, Charpentier L, Pernot E, Pons M, Madar R |
107 - 110 |
Optimization of chamber design and rapid thermal processing regimes for SiC substrates by temperature and thermal stress distribution Agueev OA, Svetlichnyi AM, Klovo AG, Kocherov AN, Izotovs DA |
111 - 114 |
Crystal interface shape simulation during SiC sublimation growth Bottcher K, Schulz D |
115 - 118 |
Growth at high rates and characterization of bulk 3C-SiC material Ferro G, Balloud C, Juillaguet S, Vicente P, Camassel J, Monteil Y |
119 - 122 |
Comparison between ar and N-2 for high-temperature treatment of 4H-SiC substrates Younes G, Ferro G, Jacquier C, Dazord J, Monteil Y |
125 - 130 |
SiC epitaxy on non-standard surfaces Matsunami H, Kimoto T |
131 - 136 |
4H-SiC epitaxial growth for high-power devices Tsuchida H, Kamata I, Jikimoto T, Miyanagi T, Izumi K |
137 - 140 |
Predictions of nitrogen doping in SiC epitaxial layers Danielsson O, Forsberg U, Janzen E |
141 - 144 |
Experiment and modeling of the large-area etching and growth rate of epitaxial SiC Meziere J, Pons M, Dedulle JM, Blanquet E, Ferret P, Di Cioccio L, Billon T |
145 - 148 |
Chemical vapor deposition of n-type SiC epitaxial layers using phosphine and nitrogen as the precursors Wang RJ, Bhat IB, Chow TP |
149 - 152 |
Wide-area homoepitaxial growth of 6H-SiC on nearly on-axis (0001) by chemical vapor deposition Nakamura S, Kimoto T, Matsunami H |
153 - 156 |
Nitrogen delta doping in 4H-SiC epilayers Henry A, Storasta L, Janzen E |
157 - 160 |
Temperature effects in SiC epitaxial growth Oliver JD |
161 - 164 |
Fast epitaxial growth of high-quality 4H-SiC by vertical hot-wall CVD Fujihira K, Kimoto T, Matsunami H |
165 - 168 |
Characterization of homoepitaxial 4H-SiC layer grown from silane/propane system Sartel C, Bluet JM, Souliere V, El-Harrouni I, Monteil Y, Mermoux M, Guillot G |
169 - 172 |
Origin and behaviour of deep levels in sublimation growth of 4H-SiC layers Syvajarvi M, Yakimova R, Ciechonski RR, Davydov D, Lebedev AA, Janzen E |
173 - 176 |
Vacancies in As-grown and electron-irradiated 4H-SiC epilayers investigated by positron annihilation Dannefaer S, Avalos V, Syvajarvi M, Yakimova R |
177 - 180 |
Computational modeling for the development of CVD SiC epitaxial growth processes Melnychuk G, Koshka Y, Yingquan S, Mazzola M, Pittman CU |
181 - 184 |
Is Al-Si a good melt for the low-temperature LPE of 4H-SiC? Jacquier C, Ferro G, Cauwet F, Viala JC, Monteil Y |
185 - 188 |
Uniformity improvement in SiC epitaxial growth by horizontal hot-wall CVD Saitoh H, Kimoto T, Matsunami H |
189 - 192 |
Features of sublimation growth on porous SiC substrates: Characteristics and properties of porous and epitaxial layers Savkina NS, Shuman VB, Ratnikov VV, Rogachev AY, Lebedev AA |
193 - 196 |
The effect of thermal gradients on SiC wafers Hallin C, Joelsson T, Janzen E |
197 - 200 |
Complete micropipe dissociation in 4H-SiC(03(3)over-bar8) epitaxial growth and its impact on reverse characteristics of Schottky barrier diodes Kimoto T, Danno K, Fujihira K, Shiomi H, Matsunami H |
201 - 204 |
Epitaxial growth of 6H-SiC by a vapor liquid solid method Ferret P, Leray A, Feuillet G, Lyan P, Pudda C, Billon T |
205 - 208 |
Growth of p-type SiC layer by sublimation epitaxy Ohta S, Furusho T, Takagi H, Ohshima S, Nisino S |
209 - 212 |
Control of pendeo epitaxial growth of 3C-SiC on silicon substrate Okui Y, Jacob C, Ohshima S, Nishino S |
213 - 216 |
Characterization of 3C-SiC films grown on 4H-and 6H-SiC substrate mesas during step-free surface hetero-epitaxy Neudeck PG, Powell JA, Spry DJ, Trunek AJ, Huang XR, Vetter WM, Dudley M, Skowronski M, Liu JQ |
217 - 220 |
Growth of SiC hetero-epitaxial films by pulsed-laser deposition - Laser frequency dependence Kusumori T, Muto H |
221 - 224 |
Thin film SiC epitaxy on Si(111) from acetylene precursor De Renzi V, Biagi R, del Pennino U |
225 - 228 |
Preparation of SiC/Si(111) hetero-epitaxial junctions by PLD and crystallographic and I-V characterization Muto H, Asano T, Kusumori T |
229 - 232 |
Hetero-epitaxial growth of 3C-SiC on carbonized silicon substrates Shimizu H, Hisada K |
233 - 236 |
High-resolution XRD investigations of the strain reduction in 3C-SiC thin films grown on Si(111) substrates Weih P, Cimalla V, Forster C, Pezoldt J, Stauden T, Spiess L, Romanus H, Hermann M, Eickhoff M, Masri P, Ambacher O |
237 - 240 |
SiC synthesis by fullerene free jets on Si(111) at low temperatures Aversa L, Verucchi R, Pedio M, Iannotta S |
241 - 244 |
Production of 8-inch SiC wafer by hybridization of single and polycrystalline SiC wafers Murata K, Fujioka N, Chinone Y, Nishino S |
247 - 252 |
Synchrotron White Beam X-ray Topography and High Resolution Triple Axis X-ray Diffraction studies of defects in SiC substrates, epilayers and devices Dudley M, Huang XR, Vetter WM, Neudeck PG |
253 - 256 |
Stacking fault formation in highly doped 4H-SiC epilayers during annealing Chung HJ, Liu JQ, Henry A, Skowronski M |
257 - 260 |
Lattice dynamics of 4H-SiC by inelastic x-ray scattering Serrano J, Strempfer J, Cardona M, Schwoerer-Bohning M, Requardt H, Lorenzen M, Stojetz B, Pavone P, Choyke WJ |
261 - 264 |
Conditions for micropipe dissociation by 4H-SiC CVD growth Kamata I, Tsuchida H, Jikimoto T, Miyanagi T, Izumi K |
265 - 268 |
Investigation of defects in 4H-SiC by synchrotron topography, Raman spectroscopy imaging and photoluminescence spectroscopy imaging Pernot E, El Harrouni I, Mermoux M, Bluet JM, Anikin M, Chaussende D, Pons M, Madar R |
269 - 272 |
Doping-related strain in n-doped 4H-SiC crystals Jacobson H, Birch J, Lindefelt U, Hallin C, Henry A, Yakimova R, Janzen E |
273 - 276 |
Stacking faults in 3C-SiC relax lattice deformation Hatta N, Yagi K, Kawahara T, Nagasawa H |
277 - 280 |
Characteristics of planar defects in shallow trenches related to the presence of micropipes Vouroutzis N, Syvajarvi M, Stoemenos J, Yakimova R |
281 - 284 |
Orientation-dependent defect formation in silicon carbide epitaxial layers Yakimova R, Syvajarvi M, Iakimov T, Okunev AO, Udal'tsov VE, Janzen E |
285 - 288 |
Comparative TEM investigation of MBE and RTCVD conversion of Si into SiC Morales FM, Molina SI, Araujo D, Cimalla V, Pezoldt J |
289 - 292 |
High-accuracy lattice constant measurements of electron-irradiated 6H-SiC single crystals Seitz C, Rempel AA, Magerl A, Gomm M, Sprengel W, Schaefer HE |
293 - 296 |
Characterization of 3C-SiC/6H-SiC heterostructures grown by vacuum sublimation Savkina NS, Strel'chuk AM, Sorokin LM, Mosina GN, Tregubova AS, Solov'ev VV, Lebedev AA |
297 - 300 |
Dynamics of 4H-SiC plasticity Karpov SY, Kulik AV, Ramm MS, Makarov YN |
301 - 304 |
Time-resolved photoluminescence of deep centers in semi-insulating 4H-SiC Magnusson B, Bergman JP, Janzen E |
305 - 308 |
Identification of dumb-bell shaped interstitials in electron irradiated 6H SiC by photoluminescence spectroscopy Steeds JW, Evans GA, Furkert S, Ley L, Hundhausen M, Schulz N, Pensl G |
309 - 312 |
Photoluminescence up-conversion processes in SiC Wagner M, Ivanov IG, Storasta L, Bergman JP, Magnusson B, Chen WM, Janzen E |
313 - 316 |
New photoluminescence features in 4H-SiC induced by hydrogenation Koshka Y, Mazzola MS, Wyatt JL |
317 - 320 |
Analysis of extended defects in 6H-SiC using photoluminescence and light beam induced current spectroscopy Binetti S, Le Donne A, Acciarri M, Cerminara M, Pizzini S |
321 - 324 |
Donor-acceptor pair luminescence in 4H-SiC doped with nitrogen and aluminum Ivanov IG, Ellison A, Janzen E |
325 - 328 |
Raman excitation profiles of 3C-, 4H-, 6H-, 15R-, and 21R-SiC Pusche R, Hundhausen M, Ley L |
329 - 332 |
Infrared optical properties of 3C, 4H and 6H silicon carbide Lindquist OPA, Arwin H, Henry A, Jarrendahl K |
333 - 336 |
Impact of compensation on optical absorption bands in the below-bandgap region in n-type (N) 6H-SiC Weingartner R, Bickermann M, Herro Z, Kunecke U, Sakwe SA, Wellmann PJ, Winnacker A |
337 - 340 |
Electrical and optical characterization of p-type boron-doped 6H-SiC bulk crystals Bickermann M, Weingartner R, Herro Z, Hofmann D, Kunecke U, Wellmann PJ, Winnacker A |
341 - 344 |
Determination of exciton capture cross-sections of neutral nitrogen donor on cubic and hexagonal sites in n-type (N) 6H-SiC Weingartner R, Albrecht A, Wellmann PJ, Winnacker A |
345 - 348 |
D-II PL intensity dependence on dose, implantation temperature and implanted species in 4H-and 6H-SiC Carlsson FHC, Sridhara SG, Hallen A, Bergman JP, Janzen E |
349 - 352 |
Application of UV scanning photoluminescence spectroscopy for minority carrier lifetime mapping Masarotto L, Bluet JM, El Harrouni I, Guillot G |
353 - 356 |
Raman imaging analysis of SiC wafers Mermoux M, Crisci A, Baillet F |
357 - 360 |
Simple method for mapping optical defects in insulating silicon carbide wafers Mier M, Boeckl J, Roth M, Balkas C, Nelson M |
361 - 364 |
Non-destructive SiC wafer evaluation based on an optical stress technique Ma XY, Parker M, Ma YF, Kubota T, Sudarshan TS |
365 - 370 |
Electrical and optical characterization of SiC Pensl G, Schmid F, Ciobanu F, Laube M, Reshanov SA, Schulze N, Semmelroth K, Nagasawa H, Schoner A, Wagner G |
371 - 374 |
Evidence for two charge states of the S-center in ion-implanted 4H-SiC David ML, Alfieri G, Monakhov EV, Hallen A, Barbot JF, Svensson BG |
375 - 378 |
Activation study of implanted N+ in 6H-SiC by scanning capacitance microscopy Raineri V, Calcagno L, Giannazzo F, Goghero D, Musumeci F, Roccaforte F, La Via F |
379 - 382 |
Majority traps observed in H+- or He+-implanted Al-doped 6H-SiC by admittance and deep level transient spectroscopy Reshanov SA, Klettke O, Pensl G |
383 - 386 |
On the unusual nature of a DLTS-detected defect in bulk n-type 6H-SiC van Wyk E, Leitch AWR |
387 - 390 |
High temperature deep level transient spectroscopy investigations of n-type 4H-SiC epitaxial layers Schoner A, Fujihira K, Kimoto T, Matsunami H |
391 - 394 |
Modeling of lattice heat conductivity and thermopower in SiC considering the four-phonon scattering process Velmre E, Udal A |
395 - 398 |
Improved p-type conductivity in heavily Al-doped SiC by ion-beam-induced nano-crystallization Heera V, Madhusoodanan KN, Mucklich A, Panknin D, Skorupa W |
399 - 402 |
Transport investigation of low-nitrogen-doped 6H-SiC ion-implantation vs. in situ doping Terziyska P, Pernot J, Contreras S, Robert JL, Di Cioccio L, Billon T |
403 - 406 |
From transport measurements to infrared reflectance spectra of n-type doped 4H-SiC layer stacks Pernot J, Camassel J, Peyre H, Contreras S, Robert JL |
407 - 410 |
Impact of phonon drag effect on Seebeck coefficient in p-6H-SiC: Experiment and simulation Bikbajevas V, Grivickas V, Stolzer M, Velmre E, Udal A, Grivickas P, Syvajarvi M, Yakimova R |
411 - 414 |
Parameters of electron-hole scattering in silicon carbide Mnatsakanov TT, Levinshtein ME, Ivanov PA, Tandoev AG, Yurkov SN, Palmour JW, Singh R |
415 - 418 |
Defect evolution in proton-irradiated 4H SiC investigated by deep level transient spectroscopy Leveque P, Martin D, Svensson BG, Hallen A |
419 - 422 |
Electrical characterization of Ni/porous SiC/n-SiC structure Grekov A, Soloviev S, Das T, Sudarshan TS |
423 - 426 |
Correlation between electrical and optical mapping of boron related complexes in 4H-SiC Storasta L, Magnusson B, Henry A, Linnarsson MK, Bergman JP, Janzen E |
427 - 430 |
Investigation of p-3C-SiC/n+-6H-SiC heterojunctions with low doped p-3C-SiC region Lebedev AA, Strel'chuk AM, Savkina NS, Bogdanova EV, Tregubova AS, Kuznetsov AN, Davydov DV |
431 - 434 |
Mapping on bulk and epitaxy layer 4H-SiC Ono R, Yatsuo T, Okushi H, Arai K |
435 - 438 |
Breakdown electric field in 4H-SiC epitaxial layer grown on various net-doping substrates Ono R, Fujimaki M, Hon-Joo N, Tanimoto S, Shinohe T, Yatsuo T, Okushi H, Arai K |
439 - 442 |
Electron-induced damage effects in 4H-SiC Schottky diodes Castaldini A, Cavallini A, Nava F, Fuochi PG, Vanni P |
443 - 446 |
Measurement of Hall mobility in 4H-SiC for improvement of the accuracy of the mobility model in device simulation Hatakeyama T, Watanabe T, Kushibe M, Kojima K, Imai S, Suzuki T, Shinohe T, Tanaka T, Arai K |
447 - 450 |
Real relationship between acceptor density and hole concentration in Al-implanted 4H-SiC Matsuura H, Sugiyama K, Nishikawa K, Nagata T, Fukunaga N |
451 - 454 |
Electrical characteristics of plasma-enhanced chemical vapor deposited silicon carbide thin films Pham HTM, Akkaya T, de Boer CR, Sarro PM |
455 - 458 |
Correlation between defects and electrical properties of 4H-SiC based Schottky diodes Scaltrito L, Porro S, Giorgis F, Mandracci P, Cocuzza M, Pirri CF, Ricciardi C, Ferrero S, Richieri G, Sgorlon C, Merlin L, Cavallini A, Castaldini A |
459 - 462 |
Electrical characterization of erbium-implanted 4H-SiC epilayers Reshanov SA, Klettke O, Pensl G, Choyke WJ |
463 - 466 |
Deep levels in as-grown 4H-SiC epitaxial layers and their correlation with CVD parameters Pintilie I, Pintilie L, Irmscher K, Thomas B |
467 - 470 |
Electrical and optical study of 4H-SiC CVD epitaxial layers irradiated with swift heavy ions Kalinina E, Kholujanov G, Onushkin G, Davydov D, Strel'chuk A, Zubrilov A, Hallen A, Konstantinov A, Skuratov V, Stano J |
471 - 476 |
Identification and annealing of common intrinsic defect centers Bockstedte M, Heid M, Mattausch A, Pankratov O |
477 - 480 |
Polytype-dependent vacancy annealing studied by positron annihilation Kawasuso A, Yoshikawa M, Maekawa M, Itoh H, Chiba T, Redmann F, Krause-Rehberg R, Weidner M, Frank T, Pensl G |
481 - 485 |
Nitrogen-vacancy complexes in SiC - Final annealing products of the silicon vacancy? Gerstmann U, Rauls E, Frauenheim T, Overhof H |
487 - 490 |
A deep erbium-related bandgap state in 4H silicon carbide Pasold G, Albrecht F, Grillenberger J, Grossner U, Hulsen C, Sielemann R, Witthuhn W |
491 - 494 |
Theoretical study of antisite aggregation in alpha-SiC Rauls E, Gali A, Deak P, Frauenheim T |
495 - 498 |
EPR studies of interface defects in n-type 6H-SiC/SiO2 using porous SiC von Bardeleben HJ, Cantin JL, Mynbaeva M, Saddow SE |
499 - 502 |
Electrical and multifrequency EPR study of nitrogen and carbon antisite-related native defect in n-type As-grown 4H-SiC Kalabukhova EN, Lukin SN, Mitchel WC |
503 - 506 |
Phosphorus-related shallow and deep defects in 6H-SiC Baranov PG, Ilyin IV, Mokhov EN, von Bardeleben HJ, Cantin JL |
507 - 510 |
EPR study of electron irradiation-induced defects in semi-insulating SiC : V von Bardeleben HJ, Cantin JL, Reshanov SA, Rastegaev VP |
511 - 514 |
Calculation of hyperfine constants of defects in 4H-SiC Gali A, Deak P, Son NT, Janzen E, von Bardeleben HJ, Monge JL |
515 - 518 |
A simple model of 3d impurities in cubic silicon carbide Parfenova II, Yuryeva EI, Reshanov SA, Rastegaev VP, Ivanovskii AL |
519 - 522 |
Effective mass of electrons in quantum-well-like stacking-fault gap states in silicon carbide Iwata H, Lindefelt U, Oberg S, Briddon PR |
523 - 526 |
A shallow acceptor complex in 4H-SiC: AlSiNCAlSi Deak P, Aradi B, Gali A, Gerstmann U, Choyke WJ |
527 - 530 |
Electronic structure of twin boundaries in 3C-SiC, Si and diamond Iwata H, Lindefelt U, Oberg S, Briddon PR |
531 - 534 |
Electronic properties of stacking faults in 15R-SiC Iwata H, Lindefelt U, Oberg S, Briddon PR |
535 - 538 |
A cause for SiC/SiO2 interface states: The site selection of oxygen in SiC Deak P, Gali A, Hajnal Z, Frauenheim T, Son NT, Janzen E, Choyke WJ, Ordejon P |
539 - 542 |
Angle-resolved studies of SiO2/SiC samples Johansson LI, Virojanadara C, Eickhoff T, Drube W |
543 - 546 |
Positron annihilation studies of defects at the SiO2/SiC interface Dekker J, Saarinen K, Olafsson HO, Sveinbjornsson EO |
547 - 550 |
A study of the shallow electron traps at the 4H-SiC/SiO2 interface Olafsson HO, Sveinbjornsson EO, Rudenko TE, Kilchytska VI, Tyagulski IP, Osiyuk IN |
551 - 554 |
Traps at the interface of 3C-SiC/SiO2-MOS-structures Ciobanu F, Pensl G, Nagasawa H, Schoner A, Dimitrijev S, Cheong KY, Afanas'ev VV, Wagner G |
555 - 558 |
Study of the wet re-oxidation annealing of SiO2/4H-SiC(0001) interface properties by AR-XPS measurements Ekoue A, Renault O, Billon T, Di Cioccio L, Guillot G |
559 - 562 |
Structural defects at SiO2/SiC interfaces detected by positron annihilation Maekawa M, Kawasuso A, Yoshikawa M, Itoh H |
563 - 566 |
Reduction of interface trapped density of SiO2/4H-SiC by oxidation of atomic oxygen Kosugi R, Fukuda K, Arai K |
567 - 570 |
High inversion channel mobility of MOSFET fabricated on 4H-SiC C(000(1)over-bar) face using H-2 post-oxidation annealing Fukuda K, Senzaki J, Kojima K, Suzuki T |
571 - 574 |
Cubic SiC surface structure studied by X-ray diffraction D'Angelo M, Enriquez H, Aristov VY, Soukiassian P, Renaud G, Barbier A, Chiang S, Semond F, Di Cioccio L, Billion T |
575 - 578 |
Adsorption of toluene on Si(100) from first principles Costanzo F, Silvestrelli P, Sbraccia C, Ancilotto F |
579 - 582 |
Atomic structure of Si-rich 3C-SiC(001)-(3x2): a photoelectron diffraction study Tejeda A, Michel EG, Dunham D, Soukiassian P, Denlinger JD, Rotenberg E, Hurych ZD, Tonner B |
583 - 586 |
Effects of initial nitridation on the characteristics of SiC-SiO2 interfaces Cheong KY, Dimitrijev S, Han J |
587 - 590 |
Ag growth on 3C-SiC(001) c(2x2) C-terminated and c(4x2) Si-terminated surfaces Rodriguez N, D'Angelo M, Aristov VY, Soukiassian P, Lescuras A, Croti C, Pedio M, Perfetti P |
591 - 594 |
Modelling the formation of nano-sized SiC on Si Safonov KL, Schmidt AA, Trushin YV, Kulikov DV, Cimalla V, Pezoldt J |
595 - 598 |
Nanostructure formation on a surface of 6H-SiC by laser radiation Medvid A, Fedorenko L, Lytvyn P, Yusupov N |
599 - 602 |
Theoretical investigation of adsorption of N-containing species at SiC(0001) surfaces Olander J, Larsson K |
605 - 608 |
Electrical activation of ion-implanted nitrogen and aluminum in 4H-SiC by excimer laser annealing Tanaka Y, Tanoue H, Arai K |
609 - 612 |
Surface properties and electrical characteristics of rapid thermal annealed 4H-SiC Bauer AJ, Rambach M, Frey L, Weiss R, Rupp R, Friedrichs P, Schorner R, Peters D |
613 - 616 |
Effective normal field dependence of inversion channel mobility in 4H-SiC MOSFETs on the (11(2)over-bar0) face Senzaki J, Kojima K, Suzuki T, Fukuda K |
617 - 620 |
Damage relaxation pre-activation anneal in Al-implanted SiC Bahng W, Song GH, Kim NK, Kim SC, Seo KS, Kim HW, Kim ED |
621 - 624 |
Electrical characterization of ion-implanted n(+)/p 6H-SiC diodes Poggi A, Nipoti R, Cardinali GC, Moscatelli F |
625 - 628 |
High-sensitivity ion beam analytical method for studying ion-implanted SiC Battistig G, Lopez JG, Khanh NQ, Morilla Y, Respaldiza MA, Szilagyi E |
629 - 632 |
SiC delta-doped-layer structures and DACFET Takahashi K, Kusumoto O, Uchida M, Yamashita K, Kitabatake M |
633 - 636 |
Annealing of a vacancy-type defect and diffusion of implanted boron in 6H-SiC Ohshima T, Uedono A, Eryu O, Lee KK, Abe K, Itoh H, Nakashima K |
637 - 640 |
Gettering effect with Al implanted into 4H-SiC CVD epitaxial layers Kalinina E, Kholujanov G, Sitnikova A, Kossov V, Yafaev R, Pensl G, Reshanov S, Hallen A, Konstantinov A |
641 - 644 |
Vacancy-type defect distributions of B-11-, N-14- and Al-27-implanted 4H-SiC studied by Positron Annihilation Spectroscopy Janson MS, Slotte J, Kuznetsov AY, Saarinen K, Hallen A |
645 - 648 |
Damage distributions induced by channeling implantation of nitrogen into 6H silicon carbide Zolnai Z, Khanh NQ, Lohner T, Ster A, Kotai E, Vickridge I, Gyulai J |
649 - 652 |
First-principles studies of N and P dopant interactions in SiC: Implications for co-doping Rurali R, Hernandez E, Godignon P, Rebollo J, Ordejon P |
653 - 656 |
Quantitative evaluation of implantation damage and damage recovery after room temperature ion-implantation of N+ and P+ ions in 6H-SiC Blanque S, Perez R, Zielinski M, Pernot J, Mestres N, Pascual J, Godignon P, Camassell J |
657 - 660 |
Porous SiC: New applications through in- and out- dopant diffusion Mynbaeva M, Kuznetsov N, Lavrent'ev A, Mynbaev K, Wolan JT, Grayson B, Ivantsov V, Syrkin A, Fomin A, Saddow SE |
661 - 664 |
Co-formation of gate electrode and ohmic contacts in SiC power MOSFETs Song GH, Bahng W, Kim N, Kim SC, Seo KS, Kim ED |
665 - 668 |
Electrochemical etching of n-type 6H-SiC using aqueous KOH solutions Kato M, Ichimura M, Arai E, Ramasamy P |
669 - 672 |
Single material ohmic contacts simultaneously formed on the source/p-well/gate of 4H-SiC vertical MOSFETs Kiritani N, Hoshi M, Tanimoto S, Adachi K, Nishizawa S, Yatsuo T, Okushi H, Arai K |
673 - 676 |
Al/Ti ohmic contacts to p-type ion-implanted 6H-SiC: Mono- and two-dimensional analysis of TLM data Moscatelli F, Scorzoni A, Poggi A, Cardinali GC, Nipoti R |
677 - 680 |
Low-frequency noise measurements as a quality indicator for ohmic contacts to n-GaN Tanuma N, Tanizaki H, Yokokura S, Matsui T, Hashiguchi S, Sikula J, Tacano M |
681 - 684 |
Thermal stability of Pd Schottky contacts to p-type 6H-SiC Samiji ME, Venter A, Leitch AWR |
685 - 688 |
Suppression of leakage current increase of 4H-SiC Schottky barrier diodes during high-temperature annealing by "face-to-face" arrangement Izumi S, Fujisawa H, Tawara T, Ueno K, Hiraoka M |
689 - 692 |
The effect of plasma etching on the electrical characteristics of 4H-SiC Schottky diodes Plank NOV, Jiang LD, Gundlach AM, Cheung R |
693 - 696 |
Use of laser interferometry and optical emission spectroscopy for monitoring the reactive ion etching of 6H-and 4H-SiC Camara N, Constantinidis G, Zekentes K |
697 - 700 |
Diffusion-welded Al contacts to p-type SiC Korolkov O, Rang T, Syrkin A, Dmitriev V |
701 - 704 |
Thermal etching of 6H-SiC (11(2)over-bar-0) substrate surface Nishiguchi T, Ohshima S, Nishino S |
705 - 708 |
Schottky barriers for Pt, Mo and Ti on 6H and 4H SiC (0001), (000(1)over-bar), (1(1)over-bar-00) and (1(2)over-bar-10) faces measured by I-V, C-V and internal photoemission Shigiltchoff O, Bai S, Devaty RP, Choyke WJ, Kimoto T, Hobgood D, Neudeck PG, Porter LM |
709 - 712 |
Characteristics of Ni Schottky contacts on compensated 4H-SiC layers Kasamakova-Kolaklieva L, Yakimova R, Kakanakov R, Kakanakova-Georgieva A, Syvajarvi M, Janzen E |
713 - 716 |
Pd-based ohmic contacts to LPE 4H-SiC with improved thermal stability Kassamakova-Kolaklieva L, Kakanakov R, Cimalla V, Hristeva N, Lepoeva G, Kuznetsov N, Zekentes K |
717 - 720 |
Surface structure of electrochemically etched alpha-SiC substrates Mikami H, Umetani A, Hatayama T, Yano H, Uraoka Y, Fuyuki T |
721 - 724 |
Schottky-ohmic transition in nickel silicide/SiC system: Is it really a solved problem? Calcagno L, Zanetti E, La Via F, Roccaforte F, Raineri V, Libertino S, Giannazzo F, Mauceri M, Musumeci P |
725 - 728 |
Gate oxide with high dielectric breakdown strength after undergoing a typical power MOSFET fabrication process Tanimoto S, Kiritani N, Hoshi M, Okushi H, Arai K |
731 - 736 |
Influence of material properties on wide-bandgap microwave power device characteristics Morvan E, Kerlain A, Dua C, Brylinski C |
737 - 739 |
A comparison of MESFETs on different 4H-Silicon carbide semi-insulating substrates Eriksson J, Rorsman N, Zirath H, Henry A, Magnusson B, Ellison A, Janzen E |
741 - 744 |
Performance of silicon carbide microwave MESFETs using a thin p-doped buffer layer Eriksson J, Rorsman N, Zirath H |
745 - 748 |
RF characteristics of short-channel SiC MESFETs Honda H, Ogata M, Sawazaki H, Ono S, Arai M |
749 - 752 |
Passivation effect on channel recessed 4H-SiC MESFETs Cha HY, Thomas CI, Koley G, Eestman LF, Spencer MG |
753 - 756 |
4H-SiC lateral RESURF MOSFET with a buried channel structure Suzuki S, Harada S, Yatsuo T, Kosugi R, Senzaki J, Fukuda K |
757 - 760 |
Comparison of 1kV Lateral RESURF MOSFETs in 4H-SiC and 6H-SiC Banerjee S, Chow TP, Gutmann RJ |
761 - 764 |
Modelling of radiation response of p-channel SiC MOSFETs Lee KK, Ohshima T, Itoh H |
765 - 768 |
Influence of depletion region length on specific on-resistance in SiC MOSFET Ohtsuka K, Tarui Y, Imaizumi M, Sugimoto H, Takami T, Ozeki T |
769 - 772 |
4H-SiC power MOSFET blocking 1200V with a gate technology compatible with industrial applications Peters D, Schorner R, Friedrichs P, Stephani D |
773 - 776 |
Simulation and measurement of switching characteristics of 4H-SiC buried-gate JFETs Koo SM, Domeij M, Zetterling CM, Ostling M, Forsberg U, Janzen E |
777 - 780 |
Optimisation of a 4H-SiC enhancement mode power JFET Horsfall AB, Johnson CM, Wright NG, O'Neill AG |
781 - 784 |
Electro-thermal simulations and measurement of silicon carbide bipolar transistors Liu W, Danielsson E, Zetterling CM, Ostling M |
785 - 788 |
Power amplification in UHF band using SiC RF power BJTs Agarwal A, Capell C, Phan B, Milligan J, Palmour JW, Stambaugh J, Bartlow H, Brewer K |
789 - 791 |
Demonstration of monolithic Darlington transistors in 4H-SiC Tang Y, Chow TP |
793 - 796 |
High-voltage modular switch based on SiCVJFETs - First results for a fast 4.5kV/1.2 Omega configuration Friedrichs P, Mitlehner H, Schorner R, Dohnke KO, Stephani D |
797 - 800 |
Design and technology considerations for a RF BJT in SiC Bakowski M, Ericsson P, Harris C, Konstantinov A, Savage S, Schoner A |
801 - 804 |
Analysis of unipolar and bipolar cascoded switches with MOS gate Bakowski M |
805 - 812 |
SiC power devices: How to be competitive towards Si-based solutions? Rupp R, Zverev I |
813 - 818 |
SiC power devices on QUASIC and SiCOI Smart-Cut (R) substrates: First demonstrations Letertre F, Daval N, Templier F, Bano E, Planson D, Di Ciocco L, Jalaguier E, Bluet JM, Billon T, Madar R, Chante JP |
819 - 822 |
Low power dissipation SiC Schottky rectifiers with a dual-metal planar structure Roccaforte F, La Via F, La Magna A, Di Franco S, Raineri V |
823 - 826 |
Characterisation of the high temperature performance of 4H-SiC Schottky barrier diodes Blasciuc-Dimitriu C, Horsfall AB, Vassilevski KV, Johnson CM, Wright NG, O'Neill AG |
827 - 830 |
Comparison between different Schottky diode edge termination structures: Simulations and experimental results La Via F, Roccaforte F, Di Franco S, Raineri V, Moscatelli F, Scorzoni A, Cardinali GC |
831 - 834 |
Optimum design of a SiC Schottky barrier diode considering reverse leakage current due to a tunneling process Hatakeyama T, Kushibe M, Watanabe T, Imai S, Shinohe T |
835 - 838 |
Characterization of the forward-conduction of 4H-SiC planar junction diode Ohyanagi T, Ohno T, Amemiya K, Watanabe A |
839 - 842 |
The electrothermal behavior of 4H-SiC Schottky diodes at forward bias considering single pulse and pulsed current operation Felsl HP, Wachutka G, Rupp R |
843 - 846 |
1kV 4H-SiC JBS rectifiers fabricated using an AlN capped anneal Zhu L, Shanbhag M, Chow TP, Jones KA, Ervin MH, Shah PB, Derenge MA, Vispute RD, Venkatesan T, Agarwal A |
847 - 850 |
Simulations of high-voltage 4H-SiC p(+)nn(+) diodes using a transient model for the deep boron level Domeij M, Zimmermann U, Aberg D, Ostermann J, Hallen A, Ostling M |
851 - 854 |
Optical switch-on of silicon carbide thyristor Levinshtein ME, Ivanov PA, Agarwal AK, Palmour JW |
855 - 858 |
Reverse current recovery in 4H-SiC diodes with n- and p-base Ivanov PA, Grekhov IV, Konstantinov AO, Samsonova TP |
859 - 862 |
SiC lateral super-junction diodes fabricated by epitaxial growth Miura M, Nakamura S, Suda J, Kimoto T, Matsunami H |
863 - 866 |
OBIC measurements of 1.3kV 6H-SiC bipolar diodes protected by junction termination extension Wang SR, Raynaud C, Planson D, Lazar M, Chante JP |
867 - 870 |
4H-SiC pn diode grown by LPE method for high power applications Kuznetsov N, Bauman D, Gavrilin A, Kassamakova L, Kakanakov R, Sarov G, Cholakova T, Zekentes K, Dmitriev V |
871 - 874 |
Characterization of a 4H-SiC high power density controlled current limiter Tournier D, Godignon P, Montserrat J, Planson D, Raynaud C, Lazar M, Chante JP, Sarrus F, Bonhomme C, de Palma JF |
875 - 878 |
Forward dynamic IV characteristics in epitaxial and implanted SiC PiN power diodes Hillkirk LM, Bakowski M |
879 - 882 |
Fabrication and simulation of 4H-SiC PiN diodes having mesa guard ring edge termination Sankin I, Dufrene JB, Merrett JN, Casady JB |
883 - 886 |
Fabrication and characterisation of high-voltage SiC-thyristors Zorngiebel V, Scharnholz S, Spahn E, Brosselard P, Arssi N, Chante JP, Planson D, Raynaud C, Spangenberg B, Kurz H |
887 - 890 |
SiC device limitation breakthrough with novel floating junction structure on 4H-SiC Adachi K, Omura I, Ono R, Nishio J, Shinohe T, Ohashi H, Arai K |
891 - 894 |
Novel buried field rings edge termination for 4H-SiC high-voltage devices Mihaila A, Udrea F, Godignon P, Trajkovic T, Brezeanu G, Rebollo J, Millan J |
895 - 899 |
To be "snappy" or not - a comparison of the transient behaviours of bipolar SiC-diodes Bartsch W, Schorner R, Mitlehner H, Dohnke KO, Thomas B, Stephani D |
901 - 906 |
Degradation in SiC bipolar devices: Sources and consequences of electrically active dislocations in SiC Lendenmann H, Bergman JP, Dahlquist F, Hallin C |
907 - 912 |
Insight into the degradation phenomenon in SiC devices from ab initio calculations of the electronic structure of single and multiple stacking faults Lindefelt U, Iwata H, Oberg S, Briddon PR |
913 - 916 |
Properties of different stacking faults that cause degradation in SiC PiN diodes Jacobson H, Bergman JP, Hallin C, Tuomi T, Janzen E |
917 - 920 |
Impact of SiC structural defects on the degradation phenomenon of bipolar SiC devices Malhan RK, Nakamura H, Onda S, Nakamura D, Hara K |
921 - 924 |
Stacking fault - Stacking fault interactions and cubic inclusions in 6H-SiC: an ab initio study Iwata H, Lindefelt U, Oberg S, Briddon PR |
925 - 928 |
Influence of stacking faults on the I-V characteristics of 4H-SiC Schottky barrier diodes fabricated on the (11(2)over-bar0) face Kojima K, Ohno T, Fujimoto T, Katsuno M, Ohtani N, Nishio J, Ishida Y, Takahashi T, Suzuki T, Tanaka T, Arai K |
929 - 932 |
Reliability of 4H-SiC p-n diodes on LPE grown layers Sarov G, Kakanakov R, Cholakova T, Kassamakova L, Hristeva N, Lepoeva G, Philipova P, Kuznetsov N, Zekentes K |
933 - 936 |
In situ studies of structural instability in operating 4H-SiC PiN diodes Galeckas A, Linnros J, Pirouz P |
937 - 940 |
SEM visibility of stacking faults in 4H-silicon carbide epitaxial and implanted layers Zimmermann U, Osterman J, Galeckas A, Hallen A |
941 - 944 |
SiC X-ray detectors for spectroscopy and imaging over a wide temperature range Bertuccio G, Casiraghi R, Gatti E, Maiocchi D, Nava F, Canali C, Cetronio A, Lanzieri C |
945 - 948 |
Effects of nitrogen radical irradiation on performance of SiC MOSFETs Yano H, Maeyama Y, Furumoto Y, Hatayama T, Uraoka Y, Fuyuki T |
949 - 952 |
New tunnel Schottky SiC devices using mixed conduction ceramics Cerda J, Morante JR, Spetz AL |
953 - 956 |
MISiCFET chemical sensors for applications in exhaust gases and flue gases Wingbrant H, Uneus L, Andersson M, Cerda J, Savage S, Svenningstorp H, Salomonsson P, Ljung P, Mattsson M, Visser JH, Kubinski D, Soltis R, Ejakov SG, Moldin D, Lofdahl M, Einehag M, Persson M, Spetz AL |
957 - 960 |
Radiation hardness of silicon carbide Lebedev AA, Kozlovski VV, Strokan NB, Davydov DV, Ivanov AM, Strel'chuk AM, Yakimova R |
961 - 964 |
NO gas detection at high temperature using thin-Pt 4H-SiC and 6H-SiC schottky diodes Khan SA, de Vasconcelos EA, Uchida H, Katsube T |
965 - 968 |
Improved understanding and optimization of SiC nearly solar blind UV photodiodes Brezeanu G, Udrea F, Amaratunga G, Mihaila A, Godignon P, Millan J, Badila M |
969 - 972 |
P-type 6H-SiC films in the creation of triode structures for low ionization radiation Ivanov AM, Strokan NB, Davydov DV, Savkina NS, Strelchuk AM, Lebedev AA, Yakimova R |
975 - 978 |
Effect of tantalum in sublimation growth of aluminum nitride Furusho T, Ohshima S, Nishino S |
979 - 982 |
Growth of AlN bulk crystals by sublimation sandwich method Mokhov EN, Roenkov AD, Vodakov YA, Karpov SY, Ramm MS, Segal AS, Makarov YA, Helava H |
983 - 986 |
Seeded PVT growth of aluminum nitride on silicon carbide Epelbaum BM, Bickermann M, Winnacker A |
987 - 990 |
Growth and characterization of epitaxial wurtzite Al1-xInxN thin films deposited by UHV reactive dual DC magnetron sputtering Seppanen T, Radnoczi GZ, Tungasmita S, Hultman L, Birch J |
991 - 994 |
Implementation of hot-wall MOCVD in the growth of high-quality GaN on SiC Kakanakova-Georgieva A, Forsberg U, Hallin C, Persson POA, Storasta L, Pozina G, Birch J, Hultman L, Janzen E |
995 - 998 |
Properties of AlN layers grown by sublimation epitaxy Beshkova M, Zakhariev Z, Birch J, Kakanakova A, Yakimova R |
999 - 1002 |
Microstructure of GaN layers grown onto (001) and (111)GaAs substrates by molecular beam epitaxy Toth L, Pecz B, Czigany Z, Amimer K, Georgakilas A |
1003 - 1006 |
Structural study of GaN layers grown on carbonized Si(111) substrates Morales FM, Ponce A, Molina SI, Araujo D, Garcia R, Ristic J, Sanchez-Garcia MA, Calleja E, Cimalla V, Pezoldt J |