3 - 8 |
Silicon carbide technology in new era Matsunami H |
9 - 14 |
Characterisation and defects in silicon carbide Bergman JP, Jakobsson H, Storasta L, Carlsson FHC, Magnusson B, Sridhara S, Pozina G, Lendenmann H, Janzen E |
15 - 20 |
Opportunities and technical strategies for silicon carbide device development Cooper JA |
23 - 28 |
High quality SiC substrates for semiconductor devices: From research to industrial production Muller SG, Brady MF, Brixius WH, Fechko G, Glass RC, Henshall D, Hobgood HM, Jenny JR, Leonard R, Malta D, Powell A, Tsvetkov VF, Allen S, Palmour J, Carter CH |
29 - 34 |
Growth and defect reduction of bulk SiC crystals Ohtani N, Fujimoto T, Katsuno M, Aigo T, Yashiro H |
35 - 38 |
Growth of 3-inch diameter 6H-SiC single crystals by sublimation physical vapor transport Wang S, Sanchez EK, Kopec A, Poplawski S, Ware R, Holmes S, Balkas CM, Timmerman AG |
39 - 42 |
Lateral enlargement of silicon carbide crystals Jacobson H, Yakimova R, Raback P, Syvajarvi M, Birch J, Janzen E |
43 - 46 |
Numerical simulation of heat and mass transfer in SiC sublimation growth Nishizawa S, Kato T, Kitou Y, Oyanagi N, Arai K |
47 - 50 |
4H polytype grain formation in PVT-grown 6H-SiC ingots Fujimoto T, Katsuno M, Ohtani N, Aigo T, Yashiro H |
51 - 54 |
The development of 2in 6H-SiC wafer with high thermal-conductivity Miyanagi Y, Nakayama K, Shiomi H, Nishino S |
55 - 58 |
Evolution of crystal mosaicity during physical vapor transport growth of SiC Katsuno M, Ohtani N, Fujimoto T, Aigo T, Yashiro H |
59 - 62 |
Reduction of macrodefects in bulk SiC single crystals Balkas CM, Maltsev AA, Roth MD, Heydemann VD, Sharma M, Yushin NK |
63 - 66 |
Model for macroscopic slits in 6H-and 4H-SiC single crystals Wollweber J, Rost HJ, Schulz D, Siche D |
67 - 70 |
Macrodefect generation in SiC single crystals caused by polytype changes Rost HJ, Doerschel J, Schulz D, Siche D, Wollweber J |
71 - 74 |
The nucleation of polytype inclusions during the sublimation growth of 6H and 4H silicon carbide Sanchez EK, Kopec A, Poplawski S, Ware R, Holmes S, Wang S, Timmerman A |
75 - 78 |
Characterization of inclusions in SiC bulk crystals grown by modified Lely method Hirose F, Kitou Y, Oyanagi N, Kato T, Nishizawa S, Arai K |
79 - 82 |
Observation of planar defects in 2-inch SiC wafer Tanaka H, Nishiguchi T, Sasaki M, Nishino S |
83 - 86 |
Flux-controlled sublimation growth by an inner guide-tube Kitou Y, Bahng W, Kato T, Nishizawa S, Arai K |
87 - 90 |
Growth 3nd evaluation of high quality SiC crystal by sublimation method Oyanagi N, Yamaguchi H, Kato T, Nishizawa S, Arai K |
91 - 94 |
'In situ synthesis' of source material from elemental Si and C during SiCPVT growth process and characterization using digital X-ray imaging Wellmann PJ, Herro Z, Straubinger TL, Winnacker A |
95 - 98 |
Influence of the crystal thickness on the SiCPVT growth rate Cherednichenko D, Khlebnikov Y, Drachev RV, Khlebnikov II, Sudarshan TS |
99 - 102 |
Micropipe formation model via surface step interaction Ohtani N, Katsuno M, Fujimoto T, Aigo T, Yashiro H |
103 - 106 |
Self-healing phenomenon of micropipes in silicon carbide Okamoto A, Seno Y, Sugiyama N, Hirose F, Hara K, Tani T, Nakamura D, Kamiya N, Onda S |
107 - 110 |
A method of reducing micropipes in thin films by using sublimation growth Oyanagi N, Nishizawa S, Arai K |
111 - 114 |
Dislocation constraint by etch-back process of seed crystal in SiC bulk crystal growth Kato T, Oyanagi N, Kitou Y, Nishizawa S, Arai K |
115 - 118 |
The effect of nitrogen on crystal growth of SiC on (11(2)over-bar0) substrates Nishiguchi T, Masuda Y, Ohshima S, Nishino S |
119 - 122 |
Temperature dependence of sublimation growth of 6H-SiC on (11(2)over-bar0) substrates Nishiguchi T, Masuda Y, Ohshima S, Nishino S |
123 - 126 |
The development of 4H-SiC {03(3)over-bar8) wafers Nakayama K, Miyanagi Y, Shiomi H, Nishino S, Kimoto T, Matsunami H |
127 - 130 |
Incorporation of boron and the role of nitrogen as a compensation source in SiC bulk crystal growth Bickermann M, Weingartner R, Hofmann D, Straubinger TL, Winnacker A |
131 - 134 |
Aluminum doping of 6H-and 4H-SiC with a modified PVT growth method Straubinger TL, Bickermann M, Rasp M, Weingartner R, Wellmann PJ, Winnacker A |
135 - 138 |
Resistivity mapping of semi-insulating 6H-SiC wafers Roth MD, Heydemann VD, Mitchel WC, Yushin NK, Sharma M, Wang S, Balkas CM |
139 - 142 |
On the preparation of vanadium-doped semi-insulating SiC bulk crystals Bickermann M, Hofmann D, Straubinger TL, Weingartner R, Winnacker A |
143 - 146 |
Solid-phase epitaxial growth of bulk SiC single crystals Pernot E, Anikin M, Pons M, Chaix-Pluchery O, Baillet F, Matko I, Madar R |
147 - 150 |
Full Si wafer conversion into bulk 3C-SiC Leycuras A, Tottereau O, Vicente P, Falkovsky L, Girard P, Camassel J |
151 - 154 |
QuaSiC Smart-Cut (R) substrates for SiC high power devices Letertre F, Jalaguier E, Di Cioccio L, Templier F, Bluet JM, Banc C, Matko I, Chenevier B, Bano E, Guillot G, Billon T, Aspar B, Madar R, Ghyselen B |
155 - 158 |
CVD SiC powder for high-purity SiC source material Ezaki S, Saito M, Ishino K |
159 - 162 |
Direct synthesis and growth of SiC single crystal from ultrafine particle precursor Yamada Y, Sagawa K |
165 - 170 |
Recent achievements and future challenges in SiC homoepitaxial growth Kimoto T, Nakazawa S, Fujihira K, Hirao T, Nakamura S, Chen Y, Hashimoto K, Matsunami H |
171 - 174 |
Growth and electrical characterization of lightly-doped thick 4H-SiC epilayers Tsuchida H, Kamata I, Jikimoto T, Izumi K |
175 - 178 |
Fast epitaxial growth of 4H-SiC by chimney-type hot-wall CVD Fujihira K, Kimoto T, Matsunami H |
179 - 182 |
High-rate epitaxial growth of 4H-SiC using a vertical-type, quasi-hot-wall CVD reactor Masahara K, Takahashi T, Kushibe M, Ohno T, Nishio J, Kojima K, Ishida Y, Suzuki T, Tanaka T, Yoshida S, Arai K |
183 - 186 |
Fast growth and doping characteristics of alpha-SiC in horizontal cold-wall chemical vapor deposition Nakamura S, Kimoto T, Matsunami H |
187 - 190 |
Highly uniform epitaxial SiC-layers grown in a hot-wall CVD reactor with mechanical rotation Schoner A, Konstantinov A, Karlsson S, Berge R |
191 - 194 |
Growth characteristics of SiC in a hot-wall CVD reactor with rotation Zhang J, Forsberg U, Isacson M, Ellison A, Henry A, Kordina O, Janzen E |
195 - 198 |
Epitaxial growth of (1120) 4H-SiC using substrate grown in the [1120] direction Kojima K, Ohno T, Senzaki J, Fukuda K, Fujimoto T, Katsuno M, Ohtani N, Nishino J, Masahara K, Ishida Y, Takahashi T, Suzuki T, Tanaka T, Yoshida S, Arai K |
199 - 202 |
Hot-wall CVD growth of 4H-SiC using Si2Cl6+C3H8+H-2 system Miyanagi T, Nishino S |
203 - 206 |
Aluminum doping of epitaxial silicon carbide grown by hot-wall CVD; Effect of process parameters Forsberg U, Danielsson O, Henry A, Linnarsson MK, Janzen E |
207 - 210 |
Aluminum incorporation into 4H-SiC layers during epitaxial growth in a hot-wall CVD system Wagner G, Leitenberger W, Irmscher K, Schmid F, Laube M, Pensl G |
211 - 214 |
Vapor-phase epitaxial growth of n-type SiC using phosphine as the precursor Wang RJ, Bhat I, Chow TP |
215 - 218 |
Investigation of residual impurities in 4H-SiC epitaxial layers grown by hot-wall chemical vapor deposition Nishio J, Kushibe M, Masahara K, Kojima K, Ohno T, Ishida Y, Takahashi T, Suzuki T, Tanaka T, Yoshida S, Arai K |
219 - 222 |
Predicting growth rates of SiC epitaxial layers grown by hot-wall chemical vapor deposition Danielsson O, Jonsson S, Henry A, Janzen E |
223 - 226 |
Simulation of the large-area growth of homoepitaxial 4H-SiC by chemical vapor deposition Pons M, Meziere J, Kuan SWT, Blanquet E, Ferret P, Di Cioccio L, Billon T, Madar R |
227 - 230 |
Simulation of high-temperature SiC epitaxial growth using vertical, quasi-hot-wall CVD reactor Hasegawa M, Miyauchi A, Masahara K, Ishida Y, Takahashi T, Ohno T, Nishio J, Suzuki T, Tanaka T, Yoshida S, Arai K |
231 - 234 |
Bending of basal-plane dislocations in VPE grown 4H-SiC epitaxial layers Ha S, Mieszkowski P, Rowland LB, Skowronski M |
235 - 238 |
The effect of epitaxial growth on warp of SiC wafers Nakayama K, Miyanagi Y, Maruyama K, Okamoto Y, Shiomi H, Nishino S |
239 - 242 |
In situ etching of 4H-SiC in H-2 with addition of HCl for epitaxial CVD growth Zhang J, Kordina O, Ellison A, Janzen E |
243 - 246 |
Surface morphology of SiC epitaxial layers grown by vertical hot-wall type CVD Takahashi K, Uchida M, Yokogawa T, Kusumoto O, Yamashita K, Miyanaga R, Kitabatake M |
247 - 250 |
Delta-doped layers of SiC grown by'pulse doping' technique Takahashi K, Yokogawa T, Uchida M, Kusumoto O, Yamashita K, Miyanaga R, Kitabatake M |
251 - 254 |
Homoepitaxial'web growth' of SiC to terminate C-axis screw dislocations and-enlarge step-free surfaces Neudeck PG, Powell JA, Trunek A, Spry D, Beheim GM, Benavage E, Abel P, Vetter WM, Dudley M |
255 - 258 |
Formation of epitaxial mesa structures on 4H-SiC (0001) and (11(2)over-bar-0) substrates Chen Y, Kimoto T, Takeuchi Y, Matsunami H |
259 - 262 |
Characteristics of boron in 4H-SiC layers produced by high-temperature techniques Kakanakova-Georgieva A, Yakimova R, Zhang J, Storasta L, Syvajarvi M, Janzen E |
263 - 266 |
Epitaxial growth of 4H-SiC with hexamethyldisilane HMDS Sartel C, Souliere V, Dazord J, Monteil Y, El-Harrouni I, Bluet JM, Guillot G |
267 - 270 |
Homoepitaxial growth of 4H-SiC on porous substrate using bis-trimethylsilmethane precursor Jeong JK, Um MY, Na HJ, Kim BS, Song IB, Kim HJ |
271 - 274 |
TEM (XHREM) and EDX studies of 6H-SiC porous layer as a substrate for subsequent homoepitaxial growth Sorokin LM, Hutchison JL, Sloan J, Mosina GN, Savkina NS, Shuman VB, Lebedev AA |
275 - 278 |
3C-SiC(100) homoepitaxial growth by chemical vapor deposition and Schottky barrier junction characteristics Ishida Y, Kushibe M, Takahashi T, Okumura H, Yoshida S |
279 - 282 |
Homoepitaxial growth of cubic silicon carbide by sublimation epitaxy Furusho T, Miyanagi T, Okui Y, Ohshima S, Nishino S |
283 - 286 |
Impact of the initial surface conditions on defect appearance in 4H-SiC epilayers Yakimova R, Jacobson H, Syajarvi M, Kakanakova-Georgieva A, Iakimov T, Virojanadara C, Johansson LI, Janzen E |
287 - 290 |
Effect of the Si droplet size on the VLS growth mechanism of SiC homoepitaxial layers Ferro G, Chaussende D, Cauwet F, Monteil Y |
291 - 294 |
Liquid-phase epitaxial growth of heavily doped Al p-type contact layers for SiC devices and resulting ohmic contacts Syrkin A, Dmitriev V, Kovalenkov O, Bauman D, Crofton J |
295 - 298 |
Traveling self-confined-solvent method: Novel LPE growth of 6H-SiC Asaoka Y, Hiramoto M, Sano N, Kaneko T |
299 - 302 |
Homoepitaxial growth of 4H-SiC thin film below 1000 degrees C microwave plasma chemical vapor deposition Okamoto M, Kosugi R, Tanaka Y, Takeuchi D, Nakashima S, Nishizawa S, Fukuda K, Okushi H, Arai K |
303 - 306 |
In situ etching of SiC wafers in a CVD system using oxygen as the source Wang RJ, Bhat I, Chow TP |
307 - 310 |
SiO2 as oxygen source for the chemical vapor transport of SiC Jacquier C, Ferro G, Cauwet F, Monteil Y |
311 - 314 |
Growth of defect-free 3C-SiC on 4H-and 6H-SiC mesas using step-free surface heteroepitaxy Neudeck PG, Powell JA, Trunek AJ, Huang XRR, Dudley M |
315 - 318 |
3C-SiC Growth on 6H-SiC (0001) substrates Matko I, Chenevier B, Audier M, Madar R, Diani M, Simon L, Kubler L, Aubel D |
319 - 322 |
Heteroepitaxial growth and characteristics of 3C-SiC on large-diameter Si(001) substrates Nagasawa H, Kawahara T, Yagi K |
323 - 326 |
Comparative study of heteroepitaxially and homoepitaxially grown 3C-SiC films Takahashi T, Ishida Y, Tsuchida H, Kamata I, Okumura H, Yoshida S, Arai K |
327 - 330 |
Growth of 3C-SiC on Si(100) by LPCVD and patterning of the grown layers Bakin A, Behrens I, Ivanov A, Peiner E, Piester D, Wehmann HH, Schlachetzki A |
331 - 334 |
Selective epitaxial growth of pyramidal 3C-SiC on patterned Si substrate Okui Y, Jacob C, Ohshima S, Nishino S |
335 - 338 |
Evaluation of carbonized layers for 3C-SiC/Si epitaxial growth by ellipsometry Shimizu H, Ohba T, Hisada K |
339 - 342 |
In situ doping of 3C-SiC grown on (0001) sapphire substrates by LPCVD Sun GS, Luo MC, Wang L, Zhu SR, Li JM, Zeng YP, Lin LY |
343 - 346 |
Improved SiCOI structures elaborated by heteroepitaxy of 3C-SiC on SOI Chassagne T, Ferro G, Wang H, Stoemenos Y, Peyre H, Contreras S, Camassel J, Monteil Y, Ghyselen B |
347 - 350 |
Study of metamorphosing top Si layer of SOI wafer into 3C-SiC using conventional electric furnace Hirai S, Jobe F, Nakao M, Izumi K |
351 - 354 |
Formation of extremely thin, quasi-single-domain 3C-SiC film on resistively heated on-axis Si(001) substrate using organo-silane buffer layer Nakazawa H, Suemitsu M |
355 - 358 |
Electrical characterization of SiC/Si heterostructures with modified interfaces Forster C, Masri P, Pezoldt J |
359 - 362 |
Void-free epitaxial growth of cubic SiC crystallites during CO heat treatment of oxidized silicon Krafcsik OH, Vida G, Josepovits KV, Deak P, Radnoczi GZ, Pecz B, Barsony I |
363 - 366 |
Reaction mechanism of the carbonization process by low-energy ion subplantation Tsubouchi N, Chayahara A, Mokuno Y, Kinomura A, Horino Y |
367 - 370 |
Comparison of the growth characteristics of SiC on Si between low-pressure CVD and triode plasma CVD Yasui K, Hashiba M, Narita Y, Akahane T |
371 - 374 |
Fabrication of alpha-SiC heteroepitaxial films by YAG-PLAD method Muto H, Kusumori T |
375 - 378 |
Low-temperature preparation of alpha-SiC epitaxial films by Nd : YAG pulsed-laser deposition Kusumori T, Muto H |
379 - 382 |
Physics of heteroepitaxy and heterophases Masri P, Pezoldt J, Sumiya M, Averous M |
385 - 390 |
Growth-induced structural defects in SiCPVT boules Skowronski M |
391 - 394 |
Polytype identification and mapping in heteroepitaxial growth of 3C on atomically flat 4H-SiC mesas using synchrotron white-beam X-ray topography Dudley M, Vetter WM, Huang XR, Neudeck PG, Powell JA |
395 - 398 |
Behavior of micropipes during growth in 4H-SiC Vouroutzis N, Yakimova R, Syvajarvi M, Jacobson H, Stoemenos J, Janzen E |
399 - 402 |
Reduced micropipe density in boule-derived 6H-SiC substrates via H etching of seed crystals Saddow SE, Elkington T, Smith MCD |
403 - 406 |
Stress distribution in 2in SiC wafer measured by photoelastic method Sasaki M, Miyanagi Y, Nakayama K, Shiomi H, Nishino S |
407 - 410 |
Characterization of 2in SiC as-grown bulk by SWBXT at SPring-8 Sasaki M, Hirai A, Miyanagi T, Furusho T, Nishiguchi T, Shiomi H, Nishino S |
411 - 414 |
Observation of 2in SiC wafer by SWBXT at SPring-8 Sasaki M, Hirai A, Miyanagi T, Furusho T, Nishiguchi T, Shiomi H, Nishino S |
415 - 418 |
Analysis of sub-surface damage-induced threading dislocations in physical vapor transport growth of 6H-SiC Liu JQ, Sanchez EK, Skowronski M |
419 - 422 |
Investigation of structural defects during 4H-SiC Schottky diode processing by synchrotron topography Pernot E, Neyret E, Moulin C, Pernot-Rejmankova P, Templier F, Di Cioccio L, Billon T, Madar R |
423 - 426 |
Structural defects in electrically degraded 4H-SiC PiN diodes Persson POA, Jacobson H, Molina-Aldareguia JM, Bergman JP, Tuomi T, Clegg WJ, Janzen E, Hultman L |
427 - 430 |
Propagation of current-induced stacking faults and forward voltage degradation in 4H-SiC PiN diodes Stahlbush RE, Fedison JB, Arthur SD, Rowland LB, Kretchmer JW, Wang S |
431 - 434 |
Optical emission microscopy of structural defects in 4H-SiC PiN diodes Galeckas A, Linnros L, Breitholtz B |
435 - 438 |
Structure of 2D-nucleation-induced stacking faults in 6H-SiC Liu JQ, Sanchez EK, Skowronski M |
439 - 442 |
Theoretical calculation of stacking fault energies in silicon carbide Iwata H, Lindefelt U, Oberg S, Briddon PR |
443 - 446 |
A simple mapping method for elementary screw dislocations in homoepitaxial SiC layers Ha S, Vetter WM, Dudley M, Skowronski M |
447 - 450 |
Replication of defects from 4H-SiC wafer to epitaxial layer Ohno T, Yamaguchi H, Kojima K, Nishio J, Masahara K, Ishida Y, Takahashi T, Suzuki T, Yoshida S |
451 - 454 |
4H-to 3C-SiC polytypic transformation during oxidation Okojie RS, Xhang M, Pirouz P, Tumakha S, Jessen G, Brillson LJ |
455 - 458 |
Oxidation-induced crystallographic transformation in heavily N-doped 4H-SiC wafers Skromme BJ, Palle K, Poweleit CD, Bryant LR, Vetter WM, Dudley M, Moore K, Gehoski T |
459 - 462 |
Investigation of the relationship between defects and electrical properties of 3C-SiC epilayers Ishida Y, Kushibe M, Takahashi T, Okumura H, Yoshida S |
463 - 466 |
RHEED: A tool for structural investigations of thin polytypic SiC layers Scharmann F, Pezoldt J |
467 - 470 |
Electron-irradiation-induced amorphization of 6H-SiC by 300 keV transmission electron microscope equipped with a field-emission gun Bae IT, Ishimaru M, Hirotsu Y |
471 - 476 |
The nature and diffusion of intrinsic point defects in SiC Bockstedte M, Heid M, Mattausch A, Pankratov O |
477 - 480 |
Theoretical investigation of an intrinsic defect in SiC Gali A, Deak P, Son NT, Janzen E |
481 - 484 |
Carbon interstitials in SiC: A model for the D-II center Mattausch A, Bockstedte M, Pankratov O |
485 - 488 |
Chemical environment of atomic vacancies in electron irradiated silicon carbide measured by a 2D-Doppler broadening technique Rempel AA, Blaurock K, Reichle KJ, Sprengel W, Schaefer HE |
489 - 492 |
Radiation-induced defects in 4H-and 6H-SiC epilayers studied by positron annihilation and deep-level transient spectroscopy Kawasuso A, Weidner M, Redmann F, Frank T, Krause-Rehberg R, Pensl G, Sperr P, Triftshauser W, Itoh H |
493 - 496 |
Vacancy defects in as-polished and in high-fluence H(+)-implanted 6H-SiC detected by slow positron annihilation spectroscopy Barthe MF, Desgardin P, Henry L, Corbel C, Britton DT, Kogel G, Sperr P, Triftshauser W, Vicente P, diCioccio L |
497 - 500 |
EPR study of single silicon vacancy-related defects in 4H-and 6H-SiC Mizuochi N, Isoya J, Yamasaki S, Takizawa H, Morishita N, Ohshima T, Itoh H |
501 - 504 |
The neutral silicon vacancy in SiC: Ligand hyperfine interaction Wagner M, Thinh NQ, Son NT, Baranov PG, Mokhov EN, Hallin C, Chen WM, Janzen E |
505 - 508 |
Properties of the UD-1 deep-level center in 4H-SiC Magnusson B, Ellison A, Janzen E |
509 - 512 |
Electronic structure of the UD3 defect in 4H-and 6H-SiC Wagner M, Magnusson B, Chen WM, Janzen E |
513 - 516 |
Depth distribution of lattice damage-related D-I and D-II defects after ion implantation and annealing of 6H-SiC Koshka Y, Melnychuck G |
517 - 520 |
Electrical properties of neutron-irradiated silicon carbide Kanazawa S, Okada M, Ishii J, Nozaki T, Shin K, Ishihara S, Kimura I |
521 - 524 |
Radiation-induced defects in p-type silicon carbide Kanazawa S, Okada M, Nozaki T, Shin K, Ishihara S, Kimura I |
525 - 528 |
Hole and electron effective masses in 6H-SiC studied by optically detected cyclotron resonance Son NT, Hallin C, Janzen E |
529 - 532 |
Electronic localization around stacking faults in silicon carbide Iwata H, Lindefelt U, Oberg S, Briddon PR |
533 - 536 |
Theoretical study of cubic polytype inclusions in 4H-SiC Iwata H, Lindefelt U, Oberg S, Briddon PR |
537 - 540 |
Full-band Monte Carlo simulation of electron transport in 3C-SiC Nilsson HE, Englund U, Hjelm M |
541 - 544 |
Physical mechanism for the anomalous behavior of n-type dopants in SiC Malhan RK, Kozima J, Yamamoto T, Fukumoto A |
545 - 548 |
Influence of junction potential distribution on effective impurity ionization time constants in SiC for admittance spectroscopy data analysis Los AV, Mazzola MS |
549 - 552 |
Electrical activity of residual boron in silicon carbide Storasta L, Bergman JP, Hallin C, Janzen E |
553 - 556 |
Ab initio calculations of B diffusion in SiC Rurali R, Hernandez E, Godignon P, Rebollo J, Ordejon P |
557 - 560 |
Aluminum and boron diffusion into (1100) face SiC substrates Soloviev SI, Gao Y, Khlebnikov Y, Khlebnikov II, Sudarshan TS |
561 - 564 |
Impurity-controlled dopant activation - The role of hydrogen in p-type doping of SiC Aradi B, Gali A, Deak P, Son NT, Janzen E |
565 - 568 |
Incorporation of hydrogen (H-1 and H-2) into 4H-SiC during epitaxial growth Linnarsson MK, Forsberg U, Janson MS, Janzen E, Svensson BG |
569 - 572 |
Hydrogen incorporation into SiC using plasma-hydrogenation Koshka Y, Draper WA, Lakshman RY, Scofield J, Saddow SE |
573 - 576 |
Polytype dependence of transition metal-related deep levels in 4H-, 6H-and 15R-SiC Grillenberger J, Achtziger N, Pasold G, Witthuhn W |
577 - 580 |
Theoretical studies of vanadium impurity in beta-SiC Tairov YM, Reshanov SA, Parfenova II, Yuryeva EI, Ivanovskii AL |
581 - 584 |
New and improved quantitative characterization of SiC using SIMS Wang L, Sams DB, Wang A, Park BS |
585 - 588 |
Experiment and theory of the anharmonic effect in C-H and C-D vibrations of SiC Choyke WJ, Devaty RP, Bai S, Gali A, Deak P, Pensl G |
589 - 592 |
Spectra associated with stacking faults in 4H-SiC grown in a hot-wall CVD reactor Bai S, Wagner G, Shishkin E, Choyke WJ, Devaty RP, Zhang M, Pirouz P, Kimoto T |
593 - 596 |
Characterization of bulk and epitaxial SiC material using photoluminescence spectroscopy Henry A, Ellison A, Forsberg U, Magnusson B, Pozina G, Janzen E |
597 - 600 |
Characterization of SiC epitaxial wafers by photoluminescence under deep UV excitation Tajima M, Tanaka M, Hoshino N |
601 - 604 |
UV scanning photoluminescence spectroscopy investigation of 6H-and 4H-SiC Masarotto L, Bluet JM, Guillot G |
605 - 608 |
Mapping of the luminescence decay of lightly-doped n-4H-SiC at room-temperature Schneider K, Helbig R |
609 - 612 |
Photoluminescence investigation of hydrogen interaction with defects in SiC Koshka Y, Mazzola MS |
613 - 616 |
Photoconductivity of lightly-doped and semi-insulating 4H-SiC and the free exciton binding energy Ivanov IG, Zhang J, Storasta L, Janzen E |
617 - 620 |
Characterization of 4H-SiC band-edge absorption properties by free-carrier absorption technique with a variable excitation spectrum Grivickas P, Grivickas V, Galeckas A, Linnros J |
621 - 624 |
Spatial mapping of the carrier concentration and mobility in SiC wafers by micro Fourier-transform infrared spectroscopy Yaguchi H, Narita K, Hijikata Y, Yoshida S, Nakashima S, Oyanagi N |
625 - 628 |
Experimental determination of the phonon-eigenvectors of silicon carbide by Raman spectroscopy Herzog B, Rohmfeld S, Pusche R, Hundhausen M, Ley L, Semmelroth K, Pensl G |
629 - 632 |
Sensitive detection of defects in alpha and beta SiC by Raman scattering Nakashima S, Nakatake Y, Ishida Y, Takahashi T, Okumura H |
633 - 636 |
Raman microprobe study of carrier density profiles in modulation-doped 6H SiC Nakashima S, Nakatake Y, Yano Y, Harima H, Ohtani N, Katsuno M |
637 - 640 |
A Raman study of metal-SiC interface reactions Kurimoto E, Harima H, Toda T, Sawada M, Nakashima S, Iwami M |
641 - 644 |
Ultrafast electron relaxation processes in SiC Tomita T, Saito S, Suemoto T, Harima H, Nakashima S |
647 - 650 |
Optical characterization of ion-implanted 4H-SiC Feng ZC, Yan F, Chang WY, Zhao JH, Lin J |
651 - 654 |
Breakdown fields along various crystal orientations in 4H-, 6H- and 3C-SiC Nakamura SI, Kumagai H, Kimoto T, Matsunami H |
655 - 658 |
Quantitative high-resolution two-dimensional profiling of SiC by scanning capacitance microscopy Raineri V, Giannazzo F, Calcagno L, Musumeci P, Roccaforte F, La Via F |
659 - 662 |
Scanning capacitance microscopy of SiC multiple PN junction structure grown by cold-wall chemical vapor deposition Suda J, Nakamura S, Miura M, Kimoto T, Matsunami H |
663 - 666 |
Carrier concentrations in implanted and epitaxial 4H-SiC by scanning spreading resistance microscopy Osterman J, Anand S, Linnarsson M, Hallen A |
667 - 670 |
Nanoscale electrical characterization of 3C-SiC layers by conductive atomic force microscopy Yahata A, Zhang L, Shinohe T |
671 - 674 |
Point-contact current voltage technique for depth profiling of dopants in silicon carbide Fukuda Y, Nishikawa K, Shimizu M, Iwakuro H |
675 - 678 |
Optical and electrical characterization of free-standing 3C-SiC films grown on undulant 6in Si substrates Yamada T, Itoh KM |
679 - 682 |
Influence of excited states of deep acceptors on hole concentrations in SiC Matsuura H |
683 - 686 |
p-3C-SiC/n-6H-SiC heterojunctions: Structural and electrical Lebedev AA, Strel'chuk AM, Davydov DV, Savkina NS, Tregubova AS, Kuznetsov AN, Soloviev VA, Poletaev NK |
687 - 690 |
Scanning acoustic microscopy in porous SiC Ostapenko S, Smith MCD, Tarasov I, Wolan JT, Mynbaeva M, Goings J, McKeon JCP, Saddow SE |
691 - 696 |
Atomic-scale passivation of silicon carbide surfaces Soukiassian P |
697 - 700 |
Adsorption of metastable molecular oxygen on SiC(0001)-root 3 x root 3 Virojanadara C, Johansson LI |
701 - 704 |
Oxidation states present on SiC (0001) after oxygen exposure Virojanadara C, Johansson LI |
705 - 708 |
Adsorbate effects of the surface structure of 6H-SiC(0001) root 3 x root 3-R30 degrees Aoyama T, Hisada Y, Mukainakano S, Ichimiya A |
709 - 712 |
In situ analysis of thermal oxidation on H-terminated 4H-SiC surfaces Jikimoto T, Tsuchida H, Kamata I, Izumi K |
713 - 716 |
A high-resolution photoemission study hydrogen-terminated 6H-SiC surfaces Sieber N, Seyller T, Ley L, Polcik M, James D, Riley JD, Leckey RCG |
717 - 720 |
Wet-chemical preparation of silicate adlayer reconstructed SiC(0001) surfaces as studied by PIES and LEED Sieber N, Seyller T, Graupner R, Ley L, Mikalo RP, Hoffmann P, Batchelor D, Schmeisser D |
721 - 724 |
Photoemission electron imaging of transition metal (Ti, Ni) surfaces on Si and SiC Labis J, Kamezawa C, Hirai M, Kusaka M, Iwami M |
725 - 728 |
In situ RHEED analysis of the Ge-induced surface reconstructions on 6H-SiC(0001) Weih P, Stauden T, Pezoldt J |
729 - 732 |
Atomic-step observations on 6H-and 15R-SiC polished surfaces Vicente P, Pernot E, Chaussende D, Camassel J |
733 - 736 |
Optimization of interface and interphase systems: The case of SiC and III-V nitrides Masri P, Pezoldt J, Sumiya M, Averous M |
737 - 742 |
Towards quantum structures in SiC Bechstedt F, Fissel A, Grossner U, Kaiser U, Weissker HC, Wesch W |
743 - 746 |
Modification of SiC properties by insertion of Ge and Si nanocrystals -Description by ab initio supercell calculations Weissker HC, Furthmuller J, Bechstedt F |
747 - 750 |
Growth and characterization of three-dimensional SiC nanostructures on Si Cimalla V, Zekentes K |
751 - 754 |
Hole resonant tunneling through SiC/Si-dot/SiC heterostructures Ikoma Y, Uchiyama K, Watanabe F, Motooka T |
755 - 758 |
Development of a multilayer SiC surface micromachining process with capabilities and design rules comparable to conventional polysilicon surface micromachining Song X, Rajgopal S, Melzak JM, Zorman CA, Mehregany M |
759 - 762 |
Influence of deposition parameters and temperature on stress and strain of in situ doped PECVD silicon carbide Pham HTM, de Boer CR, Pakula L, Sarro PM |
763 - 766 |
Thermoelectric properties of 3C-SiC produced by silicon carbonization Masuda M, Mabuchi H, Tsuda H, Matsui T, Morii K |
767 - 770 |
The brittle-to-ductile transition in 4H-SiC Zhang M, Hobgood HM, Demenet JL, Pirouz P |
773 - 778 |
Annealing of implanted layers in (1(1)over-bar00) and (11(2)over-bar0) oriented SiC Satoh M |
779 - 782 |
Range distributions of implanted ions in silicon carbide Janson MS, Linnarsson MK, Hallen A, Svensson BG |
783 - 786 |
Phosphorus ion implantation into 4H-SiC (0001) and (11(2)over-bar0) Negoro Y, Miyamoto N, Kimoto T, Matsunami H |
787 - 790 |
Electrical activation of implanted phosphorus ions in (0001)/(11(2)over-bar0)-oriented 4H-SiC Schmid F, Laube M, Pensl G, Wagner G, Maier M |
791 - 794 |
Codoping of 4H-SiC with N- and P-donors by ion implantation Laube M, Schmid F, Pensl G, Wagner G |
795 - 798 |
Improvements in electrical properties of n-type-implanted 4H-SiC substrates using high-temperature rapid thermal annealing Senzaki J, Harada S, Kosugi R, Suzuki S, Fukuda K, Arai K |
799 - 802 |
Low-temperature activation of ion-implanted dopants in 4H-SiC by excimer laser annealing Tanaka Y, Tanoue H, Arai K |
803 - 806 |
Electrical characteristics of Al+ ion-implanted 4H-SiC Tanaka H, Tanimoto S, Yamanaka M, Hoshi M |
807 - 810 |
Micro-structural and electrical properties of Al-implanted & lamp-annealed 4H-SiC Nakamura H, Watanabe H, Yamazaki J, Tanaka N, Malhan RK |
811 - 814 |
Comparison between chemical and electrical profiles in Al+ or N+ implanted and annealed 6H-SiC Nipoti R, Carnera A, Raineri V |
815 - 818 |
Damage evolution and recovery in Al-implanted 4H-SiC Zhang Y, Weber WJ, Jiang W, Hallen A, Possnert G |
819 - 822 |
Comparison of Al and Al/C Co-implants in 4H-SiC annealed with an AlN cap Jones KA, Shah PB, Derenge MA, Ervin MH, Gerardi GJ, Freitas JA, Braga GCB, Vispute RD, Sharma RP, Holland OW |
823 - 826 |
Influence of implantation temperature and dose rate on secondary defect formation in 4H-SiC Ohno T, Amemiya K |
827 - 830 |
A comparative study of high-temperature aluminum post-implantation annealing in 6H-and 4H-SiC, non-uniform temperature effects Lazar M, Raynaud C, Planson D, Locatelli ML, Isoird K, Ottaviani L, Chante JP, Nipoti R, Poggi A, Cardinali G |
831 - 834 |
Post-implantation annealing effects on the surface morphology and electrical characteristics of 6H-SiC implanted with aluminum Ohi A, Ohshima T, Yoshikawa M, Lee KK, Iwami M, Itoh H |
835 - 838 |
Ion implantation - Tool for fabrication of advanced 4H-SiC devices Kalinina EV, Kholujanov G, Gol'dberg Y, Blank T, Onushkin G, Strel'chuk A, Violina G, Kossov V, Yafaev R, Hallen A, Konstantinov A |
839 - 842 |
Annealing kinetics of implantation-induced amorphous layer in 6H-SiC (0001) Nakamura T, Matsumoto S, Horibe T, Satoh M |
843 - 846 |
Direct observation of the solid-phase recrystallization of self-implanted amorphous SiC layer on (11(2)over-bar0), (1(1)over-bar00), and (0001) oriented 6H-SiC Eryu O, Matsuo D, Abe K, Nakashima K |
847 - 850 |
Ion-implantation induced deep levels in SiC studied by isothermal capacitance transient spectroscopy (ICTS) Ono R, Fujimaki M, Senzaki J, Tanimoto S, Shinohe T, Okushi H, Arai K |
851 - 854 |
Distribution profile of deep levels in SiC observed by isothermal capacitance transient spectroscopy Fujimaki M, Ono R, Kushibe M, Masahara K, Kojima K, Shinohe T, Okushi H, Arai K |
855 - 858 |
Enhanced dopant diffusion effects in 4H silicon carbide Phelps GJ, Wright NG, Chester EG, Johnson CM, O'Neill AG, Ortolland S, Horsfall AB, Vassilevski K, Gwilliam RM |
859 - 862 |
Infrared investigation of implantation damage in 6H-SiC Camassel J, Wang HY, Pernot J, Godignon P, Mestres N, Pascual J |
863 - 866 |
Suppression of macrostep formation in 4H-SiC using a cap oxide layer Bahng W, Kim NK, Kim SC, Song GH, Kim ED |
867 - 869 |
Masking process for high-energy and high-temperature ion implantation Ohyanagi T, Onose H, Watanabe A, Someya T, Ohno T, Amemiya K, Kobayashi Y |
871 - 874 |
Laser crystallization mechanism of amorphous SiC thin films Urban S, Falk F, Gorelik T, Kaiser U |
875 - 878 |
Experimental and computer simulation studies of defects and ion-solid interactions in silicon carbide Weber WJ, Gao F, Jiang WL, Devanathan R |
879 - 884 |
Ohmic contact structure and fabrication process applicable to practical SiC devices Tanimoto S, Kiritani N, Hoshi M, Okushi H |
885 - 888 |
CoAl ohmic contact materials with improved surface morphology for p-type 4H-SiC Nakatsuka O, Koide Y, Murakami M |
889 - 892 |
NiSi2 ohmic contact to n-type 4H-SiC Nakamura T, Satoh M |
893 - 896 |
Electrical characterization of nickel silicide contacts on silicon carbide Roccaforte F, La Via F, Raineri V, Musumeci P, Calcagno L |
897 - 900 |
Effects of interfacial reactions on electrical properties of Ni ohmic contacts on n-type 4H-SiC Han SY, Kim NK, Kim ED, Lee JL |
901 - 904 |
Influence of rapid thermal annealing on Ni/6H-SiC contact formation Agueev OA, Svetlichnyi AM, Razgonov RN |
905 - 908 |
Effect of rapid thermal annealing conditions on parameters of Ni/21R-SiC contacts Litvinov VL, Demakov KD, Agueev OA, Svetlichnyi AM, Konakova RV, Lytvyn PM, Milenin VV |
909 - 912 |
Effects of surface treatments of 6H-SiC upon metal-SiC interfaces Abe K, Sumitomo M, Sumi T, Eryu O, Nakashima K |
913 - 916 |
Titanium-based ohmic contact on p-type 4H-SiC Jung KH, Cho NI, Lee JH, Yang SJ, Kim CK, Lee BT, Rim KH, Kim NK, Kim ED |
917 - 920 |
Reliable ohmic contacts to LPE p-type 4H-SiC for high-power p-n diode Kakanakov R, Kassamakova L, Hristeva N, Lepoeva G, Kuznetsov N, Zekentes K |
921 - 924 |
Schottky barriers for Pt on 6H-and 4H-SiC (0001), (000(1)over-bar), (1(1)over-bar00) and (1(2)over-bar10) faces measured by I-V, C-V and internal photoemission Shigiltchoff O, Kimoto T, Hobgood D, Neudeck PG, Porter LM, Devaty RP, Choyke WJ |
925 - 928 |
Electrical properties and interface reaction of annealed Cu/4H-SiC Schottky rectifiers Hatayama T, Kawahito K, Kijima H, Uraoka Y, Fuyuki T |
929 - 932 |
Effect of temperature treatment on Au/Pd Schottky contacts to 4H-SiC Kassamakova L, Kakanakov R, Yakimova R, Kakanakova-Georgieva A, Syvajarvi M, Wilzen L, Janzen E |
933 - 936 |
Characteristics of Schottky diodes on 6H-SiC surfaces after sacrificial anodic oxidation Kato M, Ichimura M, Arai E |
937 - 940 |
Reduction of the barrier height and enhancement of tunneling current of titanium contacts using embedded Au nano-particles on 4H and 6H silicon carbide Lee SK, Zetterling CM, Ostling M, Aberg I, Magnusson MH, Deppert K, Wernersson LE, Samuelson L, Litwin A |
941 - 944 |
Some comparative properties of diffusion-welded contacts to 6H and 4H silicon carbide Korolkov O, Rang T |
945 - 948 |
Electrical properties of graphite/p-type homoepitaxial diamond contact Chen YG, Hasegawa M, Yamanaka S, Okushi H, Kobayashi N |
949 - 952 |
Reactive ion etching process of 4H-SiC using the CHF3/O-2 mixtures and a post-O-2 plasma-etching process Kang SC, Shin MW |
953 - 956 |
Electrical properties of 4H-SiC thin films reactively ion-etched in SF6/O-2 plasma Kim BS, Jeong JK, Um MY, Na HJ, Song IB, Kim HJ |
957 - 960 |
Photoelectrochemical etching process of 6H-SiC wafers using HF-based solution and H2O2 solution as electrolytes Song JG, Shin MW |
961 - 966 |
Oxidation of silicon carbide: Problems and solutions Afanas'ev VV, Bassler M, Pensl G, Stesmans A |
967 - 972 |
Passivation of the 4H-SiC/SiO2 interface with nitric oxide Williams JR, Chung GY, Tin CC, McDonald K, Farmer D, Chanana RK, Weller RA, Pantelides ST, Holland OW, Das MK, Feldman LC |
973 - 976 |
Passivation of the oxide/4H-SiC interface Jamet P, Dimitrijev S, Tanner P |
977 - 980 |
Effect of process variations on 4H silicon carbide n-channel MOSFET mobilities Lu CY, Cooper JA, Chung GY, Williams JR, McDonald K, Feldman LC |
981 - 984 |
High-current, NO-annealed lateral 4H-SiC MOSFETs Das MK, Chung GY, Williams JR, Saks NS, Lipkin LA, Palmour JW |
985 - 988 |
N2O processing improves the 4H-SiC : SiO2 interface Lipkin LA, Das MK, Palmour JW |
989 - 992 |
Reduction of interface trap density in 4H-SiC MOS by high-temperature oxidation Okuno E, Amano S |
993 - 996 |
Improving 4H-SiC/SiO2 interface properties by depositing ultra-thin Si nitride layer prior to formation of SiO2 and annealing Wang XW, Bu HM, Laube BL, Caragianis-Broadbridge C, Ma TP |
997 - 1000 |
Improvement of SiO2/alpha-SiC interface properties by nitrogen radical treatment Maeyama Y, Yano H, Hatayama T, Uraoka Y, Fuyuki T, Shirafuji T |
1001 - 1004 |
New evidence of interfacial oxide traps in n-type 4H-and 6H-SiC MOS structures Olafsson HO, Sveinbjornsson EO, Rudenko TE, Kilchytska VI, Tyagulski IP, Osiyuk IN |
1005 - 1008 |
On shallow interface states in n type 4H-SiC metal-oxide-semiconductor structures Olafsson HO, Allerstam F, Sveinbjornsson EO |
1009 - 1012 |
Effects of successive annealing of oxides on electrical characteristics of silicon carbide metal-oxide-semiconductor structures Yoshikawa M, Satoh M, Ohshima T, Itoh H |
1013 - 1016 |
The investigation of 4H-SiC/SiO2 interfaces by optical and electrical measurements Ishida Y, Takahashi T, Okumura H, Jikimoto T, Tsuchida H, Yoshikawa M, Tomioka Y, Midorikawa M, Hijikata Y, Yoshida S |
1017 - 1020 |
Characteristics of mobile ions in the SiO2 films of SiC-MOS structures Jang SJ, Song HJ, Oh KY, Lee KH, Lim YJ, Cho NI |
1021 - 1024 |
Abnormal hysteresis property of SiC oxide C-V characteristics Choi JS, Lee WS, Shin DH, Lee HG, Kim YS, Park KH |
1025 - 1028 |
ESR characterization of SiC bulk crystals and SiO2/SiC interface Isoya J, Kosugi R, Fukuda K, Yamasaki S |
1029 - 1032 |
Characterization of the interfaces between SiC and oxide films by spectroscopic ellipsometry Tomioka Y, Iida T, Midorikawa M, Tukada H, Yoshimoto K, Hijikata Y, Yaguchi H, Yoshikawa M, Ishida Y, Kosugi R, Yoshida S |
1033 - 1036 |
X-ray photoelectron spectroscopy studies of post-oxidation process effects on oxide/SiC interfaces Hijikata Y, Yaguchi H, Yoshikawa M, Yoshida S |
1037 - 1040 |
SIMS analyses of SiO2/4H-SiC(0001) interface Yamashita K, Kitabatake M, Kusumoto P, Takahashi K, Uchida M, Miyanaga R, Itoh H, Yoshikawa M |
1041 - 1044 |
Hall measurements of inversion and accumulation-mode 4H-SiC MOSFETs Chatty K, Banerjee S, Chow TP, Gutmann RJ, Arnold E, Alok D |
1045 - 1048 |
Correlation between inversion channel mobility and interface traps near the conduction band in SiC MOSFETs Suzuki S, Harada S, Kosugi R, Senzaki J, Fukuda K |
1049 - 1052 |
Influence of the wet re-oxidation procedure on inversion mobility of 4H-SiC MOSFETs Kosugi R, Okamoto M, Suzuki S, Senzaki J, Harada S, Fukuda K, Arai K |
1053 - 1056 |
Influence of the crystalline quality of epitaxial layers on inversion channel mobility in 4H-SiC MOSFETs Kojima K, Ohno T, Suzuki S, Senzaki J, Harada S, Fukuda K, Kushibe M, Masahara K, Ishida Y, Takahashi T, Suzuki T, Tanaka T, Yoshida S, Arai K |
1057 - 1060 |
A large reduction in interface-state density for MOS capacitor on 4H-SiC (11(2)over-bar0) face using H-2 and H2O vapor atmosphere post-oxidation annealing Fukuda K, Senzaki J, Kushibe M, Kojima K, Kosugi R, Suzuki S, Harada S, Suzuki T, Tanaka T, Arai K |
1061 - 1064 |
Significant improvement of inversion channel mobility in 4H-SiC MOSFET on (11(2)over-bar0) face using hydrogen post-oxidation annealing Senzaki J, Fukuda K, Kojima K, Harada S, Kosugi R, Suzuki S, Suzuki T, Arai K |
1065 - 1068 |
4H-SiC MOSFETs on (03(3)over-bar8) face Hirao T, Yano H, Kimoto T, Matsunami H, Shiomi H |
1069 - 1072 |
Improved channel mobility in normally-off 4H-SiC MOSFETs with buried channel structure Harada S, Suzuki S, Senzaki J, Kosugi R, Adachi K, Fukuda K, Arai K |
1073 - 1076 |
4H-SiC ACCUFET with a two-layer stacked gate oxide Kaneko S, Tanaka H, Shimoida Y, Kiritani N, Tanimoto S, Yamanaka M, Hoshi M |
1077 - 1080 |
4H-SiC delta-doped accumulation-channel MOS FET Yokogawa T, Takahashi K, Kusumoto O, Uchida M, Yamashita K, Kitabatake M |
1081 - 1084 |
Channel engineering of buried-channel 4H-SiC MOSFET based on the mobility model of the oxide/4H-SiC interface Hatakeyama T, Harada S, Suzuki S, Senzaki J, Kosugi R, Fukuda K, Shinohe T, Arai K |
1085 - 1088 |
TCAD optimisation of 4H-SiC channel-doped MOSFET with p-polysilicon gate Adachi K, Johnson CM, Arai K, Fukuda K, Harada S, Shinohe T |
1089 - 1092 |
Hysteresis in transfer characteristics in 4H-SiC depletion/accumulation-mode MOSFETs Chatty K, Banerjee S, Chow TP, Gutmann RJ |
1093 - 1096 |
Gamma-ray irradiation effects on the electrical characteristics of 6H-SiC MOSFETs with annealed gate-oxide Ohshima T, Lee KK, Ohi A, Yoshikawa M, Itoh H |
1097 - 1100 |
Radiation response of p-channel 6H-SiC MOSFETs fabricated using pyrogenic conditions Lee KK, Ohshima T, Itoh H |
1101 - 1104 |
Surface morphology and chemistry of 4H-and 6H-SiC after cyclic oxidation Okojie RS, Lukco D, Keys L, Tumakha S, Brillson LJ |
1105 - 1108 |
Plasma oxidation of SiC at low temperatures (below 300 degrees C) Satoh M, Shimada H, Nakamura T, Nagamoto N, Yanagihara S |
1109 - 1112 |
Low-temperature thermal oxidation of ion-amorphized 6H-SiC Nipoti R, Parisini A, Poggi A |
1113 - 1116 |
Oxidation of porous 4H-SiC substrates Soloviev S, Das T, Sudarshan TS |
1119 - 1124 |
Advances in SiC materials and technology for Schottky diode applications Di Cioccio L, Billon T |
1125 - 1128 |
Comparison of 4H-SiC pn, pinch and Schottky diodes for the 3 kV range Peters D, Friedrichs P, Schorner R, Stephani D |
1129 - 1132 |
A JBS diode with controlled forward temperature coefficient and surge current capability Dahlquist F, Lendenmann H, Ostling M |
1133 - 1136 |
Impact of material defects on SiC Schottky barrier diodes Morisette DT, Cooper JA |
1137 - 1140 |
A comparative study of the electrical properties of 4H-SiC epilayers with continuous and dissociated micropipes Kamata I, Tsuchida H, Jikimoto T, Izumi K |
1141 - 1144 |
Analysis of high leakage currents in 4H-SiC Schottky barrier diodes using optical beam-induced current measurements Tsuji T, Izumi S, Ueda A, Fujisawa H, Ueno K, Tsuchida H, Kamata I, Jikimoto T, Izumi K |
1145 - 1148 |
4H-SiC Schottky diodes with high on/off current ratio Vassilevski KV, Horsfall AB, Johnson CM, Wright NG, O'Neill AG |
1149 - 1152 |
Optimisation of implanted guard-ring terminations in 4H-SiC Schottky diodes Horsfall AB, Vassilevski KV, Johnson CM, Wright NG, O'Neill AG, Gwilliam RM |
1153 - 1156 |
Performance of 4H-SiC Schottky diodes with Al-doped p-guard-ring junction termination at reverse bias Felsl HP, Wachutka G |
1157 - 1160 |
High-voltage pulse instabilities in SiC Schottky diodes with implanted resistive edge terminations Morisette DT, Cooper JA |
1161 - 1164 |
Development of 600 V/8 A SiC Schottky diodes with epitaxial edge termination Templier F, Ferret P, Di Cioccio L, Collard E, Lhorte A, Billon T |
1165 - 1168 |
Minimization of electric field enhancement at electrode edge by surface high resistive layer in Ti/4H-SiC Schottky barrier diode Ohtsuka K, Sugimoto H, Kinouchi S, Tarui Y, Imaizumi M, Takami T, Ozeki T |
1169 - 1172 |
Reverse characteristics of a 4H-SiC Schottky barrier diode Hatakeyama T, Shinohe T |
1173 - 1176 |
Power Schottky and p-n diodes on SiC epi-wafers with reduced micropipe density Syrkin A, Dmitriev V, Yakimova R, Henry A, Janzen E |
1177 - 1180 |
4H-SiC MPS diode fabrication and characterization in an inductively loaded half-bridge inverter up to 100 kW Alexandrov P, Wright B, Pan M, Weiner M, Fursin L, Zhao JH |
1181 - 1184 |
Performance of SiC bipolar (PiN) and unipolar (SBD) power rectifiers in current-voltage-frequency parameter space Morisette DT, Cooper JA |
1185 - 1190 |
Application-oriented unipolar switching SiC devices Friedrichs P, Mitlehner H, Schorner R, Dohnke KO, Elpelt R, Stephani D |
1191 - 1194 |
High-performance UMOSFETs in 4H-SiC Li Y, Cooper JA, Capano MA |
1195 - 1198 |
Large-area (3.3 mm x 3.3 mm) power MOSFETs in 4H-SiC Ryu SH, Agarwal A, Richmond J, Das M, Lipkin L, Palmour J, Saks N, Williams J |
1199 - 1202 |
5.0 kV 4H-SiC SEMOSFET with low RonS of 88 m Omega cm(2) Sugawara Y, Asano K, Takayama D, Ryu S, Singh R, Palmour J, Hayashi T |
1203 - 1206 |
Fabrication and initial characterization of 4H-SiC epilayer channel MOSFETs Imaizumi M, Tarui Y, Sugimoto H, Ohtsuka K, Takami T, Ozeki T |
1207 - 1210 |
Optimized P-well profile preventing punch-through for 4H-SiC power MOSFETs Shimoida Y, Kaneko S, Tanaka H, Hoshi M |
1211 - 1214 |
SiC vertical DACFET (Vertical delta-doped accumulation channel MOSFET) Kusumoto O, Yokogawa T, Yamashita K, Takahashi K, Kitabatake M, Uchida M, Miyanaga R |
1215 - 1218 |
4H-and 6H-SiC MOSFETs fabricated on sloped sidewalls formed by molten KOH etching Wahab Q, Kosugi H, Yano H, Hallin C, Kimoto T, Matsunami H |
1219 - 1222 |
A 600 VSiC trench JFET Gupta RN, Chang HR, Hanna E, Bui C |
1223 - 1226 |
A novel high-voltage normally-off 4H-SiC vertical JFET Zhao JH, Li X, Tone K, Alexandrov P, Pan M, Weiner M |
1227 - 1230 |
2 kV 4H-SiC junction FETs Onose H, Watanabe A, Someya T, Kobayashi Y |
1231 - 1234 |
Design and processing of high-voltage 4H-SiC trench junction field-effect transistor Zhu L, Chow TP |
1235 - 1238 |
Influence of trenching effect on the characteristics of buried-gate SiC junction field-effect transistors Koo SM, Lee SK, Zetterling CM, Ostling M, Forsberg U, Janzen E |
1239 - 1242 |
Static and dynamic behaviour of SiC JFET/Si MOSFET cascade configuration for high-performance power switches Mihaila A, Udrea F, Azar R, Brezeanu G, Amaratunga G |
1243 - 1246 |
Simulation study of a novel current-limiting device: A vertical alpha-SiC JFET - Controlled current limiter Tournier D, Godignon P, Planson D, Chante JP, Sarrus F |
1247 - 1250 |
Realization of a high-current and low R-ON 600V current-limiting device Nallet F, Godignon P, Planson D, Raynaud C, Chante JP |
1251 - 1254 |
Super-junction device forward characteristics and switched power limitations Adachi K, Johnson CM, Ohashi H, Shinohe T, Kinoshita K, Arai K |
1255 - 1258 |
Silicon/oxide/silicon carbide (SiOSiC) - A new approach for high voltage, high frequencies integrated circuits Udrea F, Mihaila A, Azar R |
1259 - 1264 |
High-power SiC diodes: Characteristics, reliability and relation to material defects Lendenmann H, Dahlquist F, Bergman JP, Bleichner H, Hallin C |
1265 - 1268 |
High-temperature performance of 10 kilovolts, 200 amperes (pulsed) 4H-SiC PiN rectifiers Singh R, Irvine KG, Richmond JT, Palmour JW |
1269 - 1272 |
Study of SiC PiN diodes subjected to high current density pulses Hillkirk LM, Bakowski M |
1273 - 1276 |
High-voltage SiC pn diodes with avalanche breakdown fabricated by aluminum or boron ion implantation Negoro Y, Miyamoto N, Kimoto T, Matsunami H |
1277 - 1280 |
Measurement and device simulation of avalanche breakdown in high-voltage 4H-SiC diodes including the influence of macroscopic defects Domeij M, Brunahl H, Ostling M |
1281 - 1284 |
Microstructural characterization of recombination-induced stacking faults in high-voltage SiC diodes Liu JQ, Skowronski M, Hallin C, Soderholm R, Lendenmann H |
1285 - 1288 |
Electrical characterization of high-voltage 4H-SiC diodes on high-temperature CVD-grown epitaxial layers Zimmermann U, Osterman J, Zhang J, Henry A, Hallen A |
1289 - 1292 |
Study of 4H-SiC high-voltage bipolar diodes under reverse bias using electrical and OBIC characterization Isoird K, Lazar M, Locatelli ML, Raynaud C, Planson D, Chante JP |
1293 - 1296 |
Photon emission analysis of defect-free 4H-SiC pn diodes in avalanche regime Banc C, Bano E, Ouisse T, Vassilevski K, Zekentes K |
1297 - 1300 |
Electroluminescence analysis of Al+ and B+ implanted pn diodes Fujisawa H, Tsuji T, Izumi S, Ueno K, Kamata I, Tsuchida T, Jikimoto T, Izumi K |
1301 - 1304 |
An effective high-voltage termination for SiC planar pn junctions for use in high-voltage devices and UV detectors Brezeanu G, Badila M, Godignon P, Millan J, Udrea F, Mihaila A, Amaratunga G |
1305 - 1308 |
A novel technology for the formation of a very small bevel angle for edge termination Yan F, Qin C, Zhao JH |
1309 - 1312 |
The deep boron level in high-voltage PiN diodes Aberg D, Hallen A, Osterman J, Zimmermann U, Svensson BG |
1313 - 1316 |
Electrical characteristics of 4H-SiC pn diode grown by LPE method Kuznetsov N, Bauman D, Gavrilin A, Kalinina EV |
1317 - 1320 |
Highly-doped implanted pn junction for SiC Zener diode fabrication Godignon P, Jorda X, Nipoti R, Cardinali G, Mestres N |
1321 - 1324 |
Unipolar and bipolar SiC integral cascoded switches with MOS and junction gate - Simulation study Bakowski M, Gustafsson U |
1325 - 1328 |
All-SiC inductively-loaded half-bridge inverter characterization of 4H-SiC power BJTs up to 400V/22 A Luo Y, Fursin L, Zhao JH, Alexandrov P, Wright B, Weiner M |
1329 - 1332 |
Improvement and analysis of implanted-emitter bipolar junction transistors in 4H-SiC Tang Y, Fedison JB, Chow TP |
1333 - 1336 |
On the temperature coefficient of 4H-SiC npn transistor current gain Li X, Luo Y, Zhao JH, Alexandrov P, Pan M, Weiner M |
1337 - 1340 |
Investigation of thermal properties in fabricated 4H-SiC high-power bipolar transistors Danielsson E, Zetterling CM, Ostling M, Forsberg U, Janzen E |
1341 - 1343 |
Hybrid MOS-gated bipolar transistor using 4H-SiC BJT Tang Y, Chow TP, Agarwal AK, Ryu SH, Palmour JW |
1345 - 1348 |
A novel, planar 3,000 V normally-off field gated bipolar transistor in 4H-SiC Li X, Fursin L, Zhao JH, Alexandrov P, Pan M, Weiner M, Burke T, Khalil G |
1349 - 1352 |
Dynamic performance of 3.1 kV 4H-SiC asymmetrical GTO thyristors Agarwal AK, Ivanov PA, Levinshtein ME, Palmour JW, Rumyantsev SL |
1353 - 1358 |
4H-SiC IMPATT diode fabrication and testing Vassilevski KV, Zorenko AV, Zekentes K, Tsagaraki K, Bano E, Banc C, Lebedev AA |
1359 - 1362 |
Demonstration of IMPATT diode oscillators in 4H-SiC Yuan L, Cooper JA, Webb KJ, Melloch MR |
1363 - 1366 |
Influence of semi-insulating substrate purity on the output characteristics of 4H-SiC MESFETs Sghaier N, Bluet JM, Souifi A, Guillot G, Morvan E, Brylinski C |
1367 - 1370 |
Development and demonstration of high-power X-band SiC MESFETs Chang HR, Hanna E, Hacker J, Hackett R, Bui C |
1371 - 1374 |
Hot-carrier luminescence in 4H-SiC MESFETs Banc C, Bano E, Ouisse T, Noblanc O, Brylinski C |
1375 - 1378 |
High-performance silicon carbide MESFET utilizing lateral epitaxy Konstantinov AO, Harris CI, Ericsson P |
1379 - 1382 |
Influence of gate finger width on RF characteristics of 4H-SiC MESFET Arai M, Honda H, Ogata M, Sawazaki H, Ono S |
1383 - 1386 |
Fabrication of 4H-SiC planar MESFETs having low contact resistance Na HJ, Kim HJ, Adachi K, Kiritani N, Tanimoto S, Okushi H, Arai K |
1387 - 1390 |
Surface control of 4H-SiC MESFETs Hilton KP, Uren MJ, Hayes DG, Johnson HK, Wilding PJ |
1391 - 1394 |
Characteristics of MESFETs made by ion-implantation in bulk semi-insulating 4H-SiC Mitra S, Tucker JB, Rao MV, Papanicolaou N, Jones KA |
1395 - 1398 |
Evaluation of SiC MESFET structures using large-signal time-domain simulations Jonsson R, Eriksson J, Wahab Q, Rudner S, Rorsman N, Zirath H, Svensson C |
1399 - 1402 |
4H-SiC MESFET large-signal modeling using modified Materka model Lee S, Song NJ, Burm J, An C |
1403 - 1406 |
Compatibility of VJFET technology with MESFET fabrication and its interest for system integration: Fabrication of 6H and 4H-SiC 110 V lateral MESFET Tournier D, Godignon P, Montserrat J, Planson D, Chante JP, Sarrus F |
1407 - 1410 |
The development of ultra-high frequency power 6H-SiC vertical static induction transistor with p-n junction as a gate Sankin VI, Shkrebiy PP, Kuznetsov AN, Savkina NA |
1411 - 1414 |
Silicon carbide microwave limiters Syrkin A, Dmitriev V, Lapidus A |
1415 - 1418 |
MISiCFET chemical gas sensors for high temperature and corrosive environment applications Spetz AL, Uneus L, Svenningstorp H, Wingbrant H, Harris CI, Salomonsson P, Tengstrom P, Martensson P, Ljung P, Mattsson M, Visser JH, Ejakov SG, Kubinski D, Ekedahl LG, Lundstrom I, Savage SM |
1419 - 1422 |
The effect of hydrogen diffusion in p- and n-type SiC Schottky diodes at high temperatures Uneus L, Nakagomi S, Linnarsson M, Janson MS, Svensson BG, Yakimova R, Syvajarvi M, Henry A, Janzen E, Ekedahl LG, Lunstrom I, Spetz AL |
1423 - 1426 |
Influence of epitaxial layer on SiC Schottky diode gas sensors operated under high-temperature conditions Nakagomi S, Shinobu H, Uneus L, Lundstrom I, Ekedahl LG, Yakimova R, Syvajarvi M, Henry A, Janzen E, Spetz AL |
1427 - 1430 |
A new type of SiC gas sensor with a pn-junction structure Nakashima K, Okuyama Y, Ando S, Eryu O, Abe K, Yokoi H, Oshima T |
1431 - 1434 |
Demonstration of 4H-SiC avalanche photodiode linear array Yan F, Qin C, Zhao JH, Bush M, Olsen GH |
1435 - 1438 |
4H-SiC material for Hall effect and high-temperature sensors working in harsh environments Robert JL, Contreras S, Camassel J, Pernot J, Juillaguet S, Di Cioccio L, Billon T |
1439 - 1442 |
N and p type 6H-SiC films for the creation diode and triode structure of nuclear particle detectors Ivanov AM, Strokan NB, Lebedev AA, Davydov DV, Savkina NS, Bogdanova EV |
1445 - 1448 |
Sublimation growth of bulk AlN crystals: Materials compatibility and crystal quality Epelbaum BM, Hofmann D, Bickermann M, Winnacker A |
1449 - 1452 |
Crystal growth of aluminum nitride by sublimation close space technique Furusho T, Ohshima S, Nishino S |
1453 - 1456 |
Aluminium nitride bulk crystals by sublimation method: Growth and X-ray characterization Dorozhkin SI, Lebedev AO, Maximov AY, Tairov YM |
1457 - 1460 |
Heteroepitaxial growth of insulating AlN on 6H-SiC by MBE Onojima N, Suda J, Matsunami H |
1461 - 1464 |
RHEED studies of in effect on the N-polarity GaN surface kinetics modulation in plasma-assisted molecular-beam epitaxy Shen XQ, Ide T, Shimizu M, Okumura H |
1465 - 1468 |
Surface morphology of GaN epilayer with SixN1-x buffer layer grown by ammonia-source MBE Shimizu M, Ohkita H, Suzuki A, Okumura H |
1469 - 1472 |
Growth of AlN films by hot-wall CVD and sublimation techniques: Effect of growth cell pressure Kakanakova-Georgieva A, Forsberg U, Magnusson B, Yakimova R, Janzen E |
1473 - 1476 |
GaN grown by hydride-metal organic vapor phase epitaxy (H-MOVPE) on lattice-matched oxide and silicon substrates Mastro M, Kryliouk OM, Dann T, Anderson TJ, Nikolaev AE, Melnik YV, Dmitriev VA |
1477 - 1480 |
Growth and characterization of GaGdN and AlGdN on SiC by RF-MBE Teraguchi N, Suzuki A, Nanishi Y |
1481 - 1484 |
Growth of epitaxial (SiC)(x)(AlN)(1-x) thin films on 6H-SiC by ion-assisted dual magnetron sputter deposition Tungasmita S, Persson POA, Seppanen T, Hultman L, Birch J |
1485 - 1488 |
Silicon carbide buffer layers for nitride growth on Si Masri P, Herro Z, Stauden T, Pezoldt J, Sumiya M, Averous M |
1489 - 1492 |
Crystallographic growth models of wurtzite-type thin films on 6H-SiC Ohsato H, Wada K, Kato T, Sun CJ, Razeghi M |
1493 - 1496 |
Photoluminescence and electroluminescence characterization of InxGa1-x/InyGa1-yN multiple quantum well light emitting diodes Bergman JP, Pozina G, Monemar B, Kamiyama S, Iwaya M, Amano H, Akasaki I |
1497 - 1500 |
Photoreflectance characterization of GaNAs/GaAs multiple quantum well structures Lu CR, Lee JR, Chen YY, Lee WI, Lee SC |
1501 - 1504 |
Raman scattering from wurtzite GaN bulk crystal Verma P, Yamada A |
1505 - 1510 |
Recent progress of AlGaN/GaN heterojunction FETs for microwave power applications Miyamoto H |
1511 - 1514 |
High performance AlGaN/GaN HEMTs with recessed gate Sano Y, Mita J, Yamada T, Makita T, Kaifu K, Ishikawa H, Egawa T, Jimbo T |
1515 - 1518 |
Broadband push-pull microwave power amplifier using AlGaN/GaN HEMTs on SiC Lee JW, Webb KJ |
1519 - 1522 |
Temperature dependence of DC characteristics in AlN/GaN metal insulator semiconductor field effect transistor Ide T, Shimizu M, Suzuki A, Shen XQ, Okumura H, Nemoto T |
1523 - 1526 |
Thermal analysis of GaN-based HFET devices using the unit thermal profile approach Park J, Lee CC, Kim JW, Lee JS, Lee WS, Shin JH, Shin MW |
1527 - 1530 |
AlGaN/GaN hetero field-effect transistor for a large current operation Yoshida S, Ishii H, Li J |
1531 - 1534 |
Gallium nitride power device design tradeoffs Matocha K, Chow TP, Gutmann RJ |
1535 - 1538 |
Gallium nitride metal-insulator-semiconductor capacitors using low-pressure chemical vapor deposited oxides Matocha K, Chow TP, Gutmann RJ |